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Nr. Titel Autor Jahr
1 Automatic Detection of Via Arrays in AFM Images for CMP Dishing Evaluation Zienert, Andreas* et al. 2023
2 Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding Dubey, Vikas* et al. 2023
3 Automatic Analysis of CMP Dishing in Via Arrays from AFM Images Langer, Jan* et al. 2022
4 Pulse Current Electrochemical Deposition of Copper for Through Silicon Vias in MEMS: Experiment and Simulation Hofmann, Lutz et al. 2018
5 3D Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages Hofmann, Lutz et al. 2017
6 3D-Wafer Level Packaging approaches for MEMS by using Cu-based High Aspect Ratio Through Silicon Vias Hofmann, Lutz 2017
7 Elektrochemische Pulsstromabscheidung von Kupfer für Si-Durchkontakte in MEMS: Experiment und Simulation Hofmann, Lutz et al. 2017
8 Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS Hofmann, Lutz* et al. 2016
9 3D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bonding Hofmann, Lutz et al. 2015
10 Deposition of Copper Thin Films for ULSI Interconnects by ALD of Copper Oxide and Subsequent Reduction Wächtler, Thomas et al. 2014
11 3D technologies for integration of MEMS Hofmann, Lutz et al. 2013
12 Investigations on partially filled HAR TSVs for MEMS applications Hofmann, Lutz et al. 2013
13 Technologieentwicklung für optimiertes MEMS Packaging durch Si-TSV-Rückseitenkontaktierung Meinecke, Christoph et al. 2013
14 TSVs mit hohem Aspektverhältnis und Kupfer-Bonden für MEMS Hofmann, Lutz et al. 2013
15 Vertical Integration techniques for MEMS using HAR TSV Hofmann, Lutz et al. 2013
16 ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems. Waechtler, Thomas et al. 2011
17 Copper films grown via copper oxide ALD integrated with different liner materials for interconnect applications Waechtler, Thomas et al. 2011
18 Thermal ALD of Cu via reduction of CuxO films for the advanced metallization in spintronic and ULSI interconnect systems Mueller, Steve et al. 2011
19 ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems. Waechtler, Thomas et al. 2010
20 Electrochemical deposition of reactive nanoscale metallization systems for low temperature bonding in 3D integration Hofmann, Lutz et al. 2010
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