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Nr. Titel Autor Jahr
1 Additive Fertigung gradierter Nanoverbundwerkstoffe für das Fügen mikroelektronischer Komponenten Seifert, Tobias et al. 2023
2 Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding Dubey, Vikas* et al. 2023
3 Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging Hofmann, Christian* et al. 2023
4 Inductive heating based on VHF-ISM radio band frequencies as technology platform for efficient heating of metallic micro-scaled bonding layers in MEMS packaging Hofmann, Christian et al. 2023
5 Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates Selbmann, Franz* et al. 2023
6 High Precision Liquid Level and Leak Detection Based on Capacitive Micromachined Ultrasound Transducer Saeidi, Nooshin et al. 2022
7 Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils Hofmann, Christian* et al. 2022
8 Nanolot - gradierte Nanoverbundwerkstoffe mit funktionsorientierten Eigenschaften zur Verarbeitung mit additiven Fertigungstechnologien Seifert, Tobias et al. 2022
9 Optimal design configuration for aluminum pillar fabrication towards fine pitch ultrasonic bonding applications Cirulis, Imants et al. 2022
10 An ultra-thin and highly flexible multilayer Printed Circuit Board based on Parylene Selbmann, Franz et al. 2021
11 Characterization of Capacitive Micromachined Ultrasound Transducer (Cmut) for Targeted Applications in Harsh Environments Saeidi, Nooshin* et al. 2021
12 Chip-level bonding for microelectronic components by induction sintering of micro structured Ag particles Rochala, Patrick et al. 2021
13 Chip-level bonding for microelectronic components by induction sintering of micro structuredAg particles Rochala, Patrick et al. 2021
14 Investigation of biocompatible Parylene as triboelectric layer for wearable energy harvesting Selbmann, Franz* et al. 2021
15 Reaktives Bonden Vogel, Klaus et al. 2021
16 Silver sintering technology based on induction heating for chip level bonding Hofmann, Christian et al. 2021
17 Technologies for Power Device Packaging by Using Solid Liquid Interdiffusion Bonding - SLID Baum, Mario et al. 2021
18 Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems Selbmann, Franz et al. 2020
19 Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems Selbmann, Franz et al. 2020
20 A Novel Method for MEMS Wafer-Level Packaging: Selective and Rapid Induction Heating for Copper-Tin SLID Bonding Hofmann, Christian* et al. 2019
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Anzahl der Dokumente: 118

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