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Nr. Titel Autor Jahr
1 Galvanische Aluminiumabscheidung für das Waferlevel Thermokompressionsbonden mit dicken Aluminiumschichten Braun, Silvia 2025
2 Investigation of Capacitive Micromachined Ultrasound Transducer for NDT and material inspection in metals and alloys Selvam, Karman et al. 2025
3 Non-Contact Detection of Concentration in Fluid Mixtures Using Capacitive Micromachined Ultrasound Transducer (CMUT) Selvam, Karman et al. 2025
4 Advances in Parylene Adhesive Bonding for the Realization of Biocompatible Microsystems Selbmann, Franz et al. 2024
5 Aerosol Jet Druck gradierter Nanolot-Zwischenschichten für die Montage von Komponenten elektronischer Baugruppen Seifert, Tobias et al. 2024
6 High temperature liquid level monitoring using Capacitive Micromachined Ultrasound Transducer (CMUT) Saeidi, Nooshin et al. 2024
7 Impact of Dielectric Types on Surface Topography for Wafer-Level Hybrid Bonding Dubey, Vikas* et al. 2024
8 Investigations on Low-Temperature Aluminium Thermocompression Bonding Using Surface Passivation Technique Diex, Kevin et al. 2024
9 Investigations on low-temperature thermocompression bonding of passivated aluminum for enhanced wafer-level packaging and heterogeneous integration Diex, Kevin* et al. 2024
10 Low Temperature LiTaO3-to-Si Wafer Bonding Richter, Dominic et al. 2024
11 Navigating Complex Process and Design Challenges in Hybrid Bonding for Advanced Semiconductor Integration: A Comprehensive Analysis Dubey, Vikas* et al. 2024
12 Parylene as a Novel Packaging Material for Adhesive Bonding, Flexible Electronics and Wafer Level Packaging Selbmann, Franz et al. 2024
13 Process Development of Aluminum Electroplating from an Ionic Liquid on 150 mm Wafer Level Braun, Silvia* et al. 2024
14 Underwater sensing applications using Capacitive Micromachined Ultrasonic Transducers (CMUTs) Vishwanatha, Meghana et al. 2024
15 Additive Fertigung gradierter Nanoverbundwerkstoffe für das Fügen mikroelektronischer Komponenten Seifert, Tobias et al. 2023
16 Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding Dubey, Vikas* et al. 2023
17 Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging Hofmann, Christian* et al. 2023
18 Inductive heating based on VHF-ISM radio band frequencies as technology platform for efficient heating of metallic micro-scaled bonding layers in MEMS packaging Hofmann, Christian et al. 2023
19 Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates Selbmann, Franz* et al. 2023
20 High Precision Liquid Level and Leak Detection Based on Capacitive Micromachined Ultrasound Transducer Saeidi, Nooshin et al. 2022
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Anzahl der Dokumente: 132

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