Navigation

Springe zum Hauptinhalt
Universitätsbibliothek
Universitätsbibliographie

Ergebnis der Datenbankabfrage

Nr. Titel Autor Jahr
1 Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems Selbmann, Franz et al. 2020
2 A Novel Method for MEMS Wafer-Level Packaging: Selective and Rapid Induction Heating for Copper-Tin SLID Bonding Hofmann, Christian* et al. 2019
3 Fabrication of Nano Porous Gold towards Wafer Level Packaging Hertel, Silvia et al. 2019
4 Induktionserwärmung für das Cu-Sn SLID-Waferbonden zum Packaging in der Mikrosystemtechnik Hofmann, Christian et al. 2019
5 Joining two worlds – hybrid integration of silicon based electronics and printed functionalities Roscher, Frank et al. 2019
6 3D-Packaging-Technologien zur Herstellung intelligenter medizinischer Implantate. Elektronische Baugruppen und Leiterplatten Wünsch, Dirk et al. 2018
7 Aluminum Patterned Electroplating from AlCl3–[EMIm]Cl Ionic Liquid towards Microsystems Application Al Farisi, Muhammad Salmann* et al. 2018
8 An Improved Design for 2D Arrays of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, and Characterization Baum, Mario* et al. 2018
9 Electrochemical deposition of reactive material systems for assembly and packaging applications Hertel, Silvia et al. 2018
10 Elektrochemische Abscheidung für die Leiterplatte Hertel, Silvia et al. 2018
11 Inkjet printing of patterned nanocarbon absorber layers for pyroelectric infrared detectors Zeiner, Christian et al. 2018
12 Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl Ionic Liquid for microsystems application Al Farisi, Muhammad Salman* et al. 2018
13 Parylene as a dielectric material for electronic applications in space Selbmann, Franz* et al. 2018
14 Reactive bonding with oxide based reactive multilayers Vogel, Klaus et al. 2018
15 3D Packaging Technologies for Smart Medical Implants Schröder, Tim et al. 2017
16 Dünnfilmverkapselungen für medizinische Anwendungen Selbmann, Franz et al. 2017
17 Galvanische Abscheidung von Aluminium für die Mikrosystem- und Leiterplattentechnik Hertel, Silvia et al. 2017
18 Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor Baum, Mario et al. 2017
19 Investigations on Parylene C for its Integrability into MEMS Selbmann, Franz et al. 2017
20 Temporary wafer bonding - key technology for MEMS devices Wünsch, Dirk* et al. 2017
Aktuelle Seite:
Anzahl der Ergebnisseiten: 5
Anzahl der Dokumente: 97

Presseartikel

Soziale Medien

Verbinde dich mit uns: