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Nr. Titel Autor Jahr
1 Aerosol Jet Druck gradierter Nanolot-Zwischenschichten für die Montage von Komponenten elektronischer Baugruppen Seifert, Tobias et al. 2024
2 High temperature liquid level monitoring using Capacitive Micromachined Ultrasound Transducer (CMUT) Saeidi, Nooshin et al. 2024
3 Impact of Dielectric Types on Surface Topography for Wafer-Level Hybrid Bonding Dubey, Vikas* et al. 2024
4 Investigations on Low-Temperature Aluminium Thermocompression Bonding Using Surface Passivation Technique Diex, Kevin et al. 2024
5 Investigations on low-temperature thermocompression bonding of passivated aluminum for enhanced wafer-level packaging and heterogeneous integration Diex, Kevin* et al. 2024
6 Low Temperature LiTaO3-to-Si Wafer Bonding Richter, Dominic et al. 2024
7 Navigating Complex Process and Design Challenges in Hybrid Bonding for Advanced Semiconductor Integration: A Comprehensive Analysis Dubey, Vikas* et al. 2024
8 Parylene as a Novel Packaging Material for Adhesive Bonding, Flexible Electronics and Wafer Level Packaging Selbmann, Franz et al. 2024
9 Process Development of Aluminum Electroplating from an Ionic Liquid on 150 mm Wafer Level Braun, Silvia* et al. 2024
10 Underwater sensing applications using Capacitive Micromachined Ultrasonic Transducers (CMUTs) Vishwanatha, Meghana et al. 2024
11 Additive Fertigung gradierter Nanoverbundwerkstoffe für das Fügen mikroelektronischer Komponenten Seifert, Tobias et al. 2023
12 Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding Dubey, Vikas* et al. 2023
13 Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging Hofmann, Christian* et al. 2023
14 Inductive heating based on VHF-ISM radio band frequencies as technology platform for efficient heating of metallic micro-scaled bonding layers in MEMS packaging Hofmann, Christian et al. 2023
15 Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates Selbmann, Franz* et al. 2023
16 High Precision Liquid Level and Leak Detection Based on Capacitive Micromachined Ultrasound Transducer Saeidi, Nooshin et al. 2022
17 Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils Hofmann, Christian* et al. 2022
18 Nanolot - gradierte Nanoverbundwerkstoffe mit funktionsorientierten Eigenschaften zur Verarbeitung mit additiven Fertigungstechnologien Seifert, Tobias et al. 2022
19 Optimal design configuration for aluminum pillar fabrication towards fine pitch ultrasonic bonding applications Cirulis, Imants et al. 2022
20 An ultra-thin and highly flexible multilayer Printed Circuit Board based on Parylene Selbmann, Franz et al. 2021
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Anzahl der Dokumente: 128

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