Universitätsbibliothek
Universitätsbibliographie

Universitätsbibliographie | Universitätsbibliothek | TU Chemnitz

Universitätsbibliothek

Ergebnis der Datenbankabfrage

Nr.	Titel	Autor	Jahr
1	Exchange bias and diffusion processes in laser annealed CoFeB/IrMn thin films	Sharma, A. et al.	2019
2	Nanomorphology of CNT Bundles Upon Wafer-Level Fabrication of CNT-FETs	Blaudeck, Thomas et al.	2016
3	Characterization of Horizontally-aligned Carbon Nanotubes: Impact of Tip-induced Strain and Bias Voltage	Bayat, P. et al.	2013
4	ALD of Metal and Metal Oxide Thin Films for Applications in ULSI Metallization Systems and Spintronic Layer Stacks	Waechtler, T. et al.	2012
5	Fabrication and Characterization of CNT via interconnects for application in integrated circuits	Fiedler, H. et al.	2012
6	ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems.	Waechtler, Thomas et al.	2010
7	Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials (Talk)	Fischer, Tobias et al.	2010
8	Copper and Copper Oxide Composite Films Deposited by ALD on Tantalum-Based Diffusion Barriers.	Waechtler, T. et al.	2008
9	Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics: Impact of wet etch media on diffusion barriers, copper, and the Cu/SiC:H interface.	Schulze, K. et al.	2008
10	Investigations on via geometry and wetting behavior for the filling of Through Silicon Vias by copper electro depostition.	Hofmann, L. et al.	2008
11	New precursors for CVD copper metallization.	Norman, J.A.T. et al.	2008
12	Optical, electrical and structural properties of spin-on MSQ low-k dielectrics over a wide temperature range.	Ahner, N. et al.	2008
13	Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits	Rudra, Sukumar* et al.	2008
14	Study of Nano-mechanical Properties for Thin Porous Films through Instrumented Indentation : SiO2 Low Dielectric Constant Films as an Example.	Herrmann, M. et al.	2008
15	Influence of barrier crystallization on CV characteristics of MIS structures	Ecke, Ramona et al.	2007
16	Thermal Behavior of Interconnect Systems: A Comparison of low-k, Airgap and SiO2 Integration	Schulze, K. et al.	2007
17	Thermomechanical properties of thin organosilicate glass films treated with ultraviolet-assisted cure	Iacopi, F. et al.	2007
18	Determination of Youngs modulus and yield stress of porous low-k materials by nanoindentation	Herrmann, Matthias et al.	2006

Aktuelle Seite:
Anzahl der Ergebnisseiten:	1
Anzahl der Dokumente:	18