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Nr. Titel Autor Jahr
1 Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging Hofmann, Christian* et al. 2023
2 Inductive heating based on VHF-ISM radio band frequencies as technology platform for efficient heating of metallic micro-scaled bonding layers in MEMS packaging Hofmann, Christian et al. 2023
3 Inductive Sintering Module for Improved Multi-Die Attach in the Field of Power Packaging Hofmann, Christian et al. 2023
4 Inductive Sintering of Silver Micro Particles for Bonding of Microelectronic Components Rochala, Patrick* et al. 2023
5 Induktives Solid-Liquid-Interdiffusionsbonden auf Basis miniaturisierter Induktionsspulen für die Mikrosystemtechnik Hofmann, Christian et al. 2023
6 Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils Hofmann, Christian* et al. 2022
7 Chip-level bonding for microelectronic components by induction sintering of micro structured Ag particles Rochala, Patrick et al. 2021
8 Chip-level bonding for microelectronic components by induction sintering of micro structuredAg particles Rochala, Patrick et al. 2021
9 Reaktives Bonden Vogel, Klaus et al. 2021
10 Silver sintering technology based on induction heating for chip level bonding Hofmann, Christian et al. 2021
11 Technologies for Power Device Packaging by Using Solid Liquid Interdiffusion Bonding - SLID Baum, Mario et al. 2021
12 Induktives Fügen in der Mikrosystemtechnik Hofmann, Christian et al. 2020
13 Selective induction heating of metallic microstructures for wafer-level MEMS packaging Fröhlich, Alexander* et al. 2020
14 A Novel Method for MEMS Wafer-Level Packaging: Selective and Rapid Induction Heating for Copper-Tin SLID Bonding Hofmann, Christian* et al. 2019
15 Induktionserwärmung für das Cu-Sn SLID-Waferbonden zum Packaging in der Mikrosystemtechnik Hofmann, Christian et al. 2019
16 Selective Induction Heating of Metallic Microstructures for Wafer-Level MEMS Packaging Fröhlich, Alexander et al. 2019
17 Verfahren zum Erwärmen einer Vielzahl von elektrisch leitfähigen Strukturen sowie Vorrichtungen zur Verwendung in dem Verfahren Fröhlich, Alexander et al. 2019
18 Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K Brunschwiler, Thomas et al. 2016
19 Self-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects Hofmann, Christian et al. 2015
20 Investigation of Low Temperature Wafer Bonding Using Plasma Activation Wünsch, Dirk et al. 2014
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