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Nr. Titel Autor Jahr
1 Design of an inductive sinter module for power packaging: FEM analysis and thermal management characterization based on multi-die applications Hofmann, Christian et al. 2024
2 Forschungsprojekt Train IntegrityMonitoring System am SRCC Kunze, Michael* et al. 2024
3 Investigation of Wafer-Level Electromagnetic Heating of Metallic Frames at Radio Frequencies: Analysis and Characterization of Standing Waves Panhale, Sushant et al. 2024
4 Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging Hofmann, Christian* et al. 2023
5 Inductive heating based on VHF-ISM radio band frequencies as technology platform for efficient heating of metallic micro-scaled bonding layers in MEMS packaging Hofmann, Christian et al. 2023
6 Inductive Sintering Module for Improved Multi-Die Attach in the Field of Power Packaging Hofmann, Christian et al. 2023
7 Inductive Sintering of Silver Micro Particles for Bonding of Microelectronic Components Rochala, Patrick* et al. 2023
8 Induktives Solid-Liquid-Interdiffusionsbonden auf Basis miniaturisierter Induktionsspulen für die Mikrosystemtechnik Hofmann, Christian et al. 2023
9 Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils Hofmann, Christian* et al. 2022
10 Chip-level bonding for microelectronic components by induction sintering of micro structured Ag particles Rochala, Patrick et al. 2021
11 Chip-level bonding for microelectronic components by induction sintering of micro structuredAg particles Rochala, Patrick et al. 2021
12 Reaktives Bonden Vogel, Klaus et al. 2021
13 Silver sintering technology based on induction heating for chip level bonding Hofmann, Christian et al. 2021
14 Technologies for Power Device Packaging by Using Solid Liquid Interdiffusion Bonding - SLID Baum, Mario et al. 2021
15 Induktives Fügen in der Mikrosystemtechnik Hofmann, Christian et al. 2020
16 Selective induction heating of metallic microstructures for wafer-level MEMS packaging Fröhlich, Alexander* et al. 2020
17 A Novel Method for MEMS Wafer-Level Packaging: Selective and Rapid Induction Heating for Copper-Tin SLID Bonding Hofmann, Christian* et al. 2019
18 Induktionserwärmung für das Cu-Sn SLID-Waferbonden zum Packaging in der Mikrosystemtechnik Hofmann, Christian et al. 2019
19 Selective Induction Heating of Metallic Microstructures for Wafer-Level MEMS Packaging Fröhlich, Alexander et al. 2019
20 Verfahren zum Erwärmen einer Vielzahl von elektrisch leitfähigen Strukturen sowie Vorrichtungen zur Verwendung in dem Verfahren Fröhlich, Alexander et al. 2019
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