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Nr. Titel Autor Jahr
1 Giant Piezoelectricity of Deformed Aluminum Nitride Stabilized through Noble Gas Interstitials for Energy Efficient Resonators Fiedler, Holger et al. 2021
2 Back-end-of-line compatible contact materials for carbon nanotube based interconnects Fiedler, Holger* et al. 2015
3 Carbon nanotube based via interconnects: Performance estimation based on the resistance of individual carbon nanotubes Fiedler, Holger et al. 2014
4 Localization length of integrated multi-walled carbon nanotubes Fiedler, Holger et al. 2014
5 Preparation and characterization of Carbon Nanotube based vertical interconnections for integrated circuits Fiedler, Holger 2014
6 Wafer-level integration of carbon nanotubes for high-frequency field-effect transistors Tittmann, Jana et al. 2014
7 ALD of Transition Metals and Metal Oxides for Applications in Electronics and Sensor Devices Waechtler, Thomas et al. 2013
8 Conductive AFM for characterization of MW-CNT-based via interconnect systems Toader, Marius et al. 2013
9 Conductive AFM for CNT characterization Toader, Marius* et al. 2013
10 Copper oxide atomic layer deposition on thermally pretreated multi-walled carbon nanotubes for interconnect applications Melzer, Marcel et al. 2013
11 Low resistance carbon nanotube - metal contact for interconnect applications Fiedler, Holger et al. 2013
12 Manipulation of Ni catalyst particle size, shape and areal density on TiN support layer for growth of vertical aligned CNTs Tittmann, Jana et al. 2013
13 Back-end-of the line compatible homogeneous coating of vertical aligned carbon nanotubes with a conductive diffusion barrier for interconnect applications Fiedler, Holger et al. 2012
14 Conductive AFM for CNTs characterisation Toader, M. et al. 2012
15 Distinguishing between Individual Contributions to the Via Resistance in Carbon Nanotubes Based Interconnects Fiedler, Holger* et al. 2012
16 Processes for wafer level integration of carbon nanotubes in electronic and sensor applications Hermann, Sascha et al. 2012
17 Variation of the growth behavior of copper oxide deposited via ALD on thermally pretreated CNTs Melzer, Marcel et al. 2012
18 Wafer level approaches for the integration of carbon nanotubes in electronic and sensor applications Hermann, Sascha et al. 2012
19 Fabrication and characterisation of CNT via interconnects for application in ULSI circuits Fiedler, Holger et al. 2011
20 Influence of copper on the catalytic carbon nanotube growth process Fiedler, Holger et al. 2011
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