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Nr. Titel Autor Jahr
1 Enhancing nanostructure and energy harvesting efficiency in sustainable BCZT piezoelectric materials through calcination temperature optimization Missaoui, Sarra* et al. 2025
2 Tailoring Nanostructure and Energy Harvesting Performance in Sustainable Bczt Piezoelectric Materials Through Calcination Temperature Control Missaoui, Sarra et al. 2025
3 Truly integrated carbon nanotubes (CNT) in oxide ceramics for micro-strain sensing applications Rajendran, Dhivakar* et al. 2025
4 Full-Field IR-Thermography for Bond-Quality Inspection of Electroplated Aluminium Interconnects for Cryo-SiP Architectures Wunderle, Bernhard et al. 2024
5 Full-Field Through-Chip IR-Thermography-based Quality Testing & Failure Analysis on Electroplated Aluminium Interconnects for Cryogenic Applications in Ion-Trap Quantum Computers May, Daniel* et al. 2024
6 Natural fibers for performance boosting of BaTiO3-PDMS flexible piezoelectric composite generators Ayadi, Mohamed Dhia* et al. 2024
7 Physics of failure based lifetime modelling for sintered silver die attach in power electronics: Accelerated stress testing by isothermal bending and thermal shock in comparison Heilmann, Jens* et al. 2023
8 Mechanical Characterization of Compact Rolled-up Microtubes Using In Situ Scanning Electron Microscopy Nanoindentation and Finite Element Analysis Moradi, Somayeh* et al. 2021
9 Residual Stress Characterisation of Thin Sputtered Copper Films on Silicon Exploiting Membrane Resonance within a Specimen Centred Approach Wunderle, Bernhard* et al. 2020
10 Micro Bending Test on Double Cantilever Beams: A specimen-centred approach to accurate determination of the visco-plastic properties of Sintered Silver for Power Electronics applications Zschenderlein, Uwe* et al. 2019
11 Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data Wunderle, Bernhard* et al. 2018
12 Thermo-mechanical reliability of sintered all-Cu electrical fine pitch interconnects under isothermal fatigue testing benchmarked against soldered and TLP-bonded SnAg3.5 joints Kumar, Akhil et al. 2018
13 Correlation between Mechanical Material Properties and Stress in 3D-Integrated Silicon Microstructures Stiebing, Martin* et al. 2017
14 Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests Heilmann, Jens* et al. 2017
15 Advances and challenges of experimental reliability investigations for lifetime modelling of sintered silver based interconnections Heilmann, Jens* et al. 2016
16 All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering Zürcher, Jonas et al. 2016
17 Re-building the Underfill : Performance of percolating fillers at package scale Zschenderlein, Uwe* et al. 2016
18 Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K Brunschwiler, Thomas et al. 2016
19 Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks Brunschwiler, Thomas et al. 2016
20 Advances in percolated thermal underfill (PTU) simulations for 3D-integration Kumar, Sridhar Ganesh et al. 2015
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