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Nr. Titel Autor Jahr
1 Physics of failure based lifetime modelling for sintered silver die attach in power electronics: Accelerated stress testing by isothermal bending and thermal shock in comparison Heilmann, Jens* et al. 2023
2 Mechanical Characterization of Compact Rolled-up Microtubes Using In Situ Scanning Electron Microscopy Nanoindentation and Finite Element Analysis Moradi, Somayeh* et al. 2021
3 Residual Stress Characterisation of Thin Sputtered Copper Films on Silicon Exploiting Membrane Resonance within a Specimen Centred Approach Wunderle, Bernhard* et al. 2020
4 Micro Bending Test on Double Cantilever Beams: A specimen-centred approach to accurate determination of the visco-plastic properties of Sintered Silver for Power Electronics applications Zschenderlein, Uwe* et al. 2019
5 Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data Wunderle, Bernhard* et al. 2018
6 Thermo-mechanical reliability of sintered all-Cu electrical fine pitch interconnects under isothermal fatigue testing benchmarked against soldered and TLP-bonded SnAg3.5 joints Kumar, Akhil et al. 2018
7 Correlation between Mechanical Material Properties and Stress in 3D-Integrated Silicon Microstructures Stiebing, Martin* et al. 2017
8 Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests Heilmann, Jens* et al. 2017
9 Advances and challenges of experimental reliability investigations for lifetime modelling of sintered silver based interconnections Heilmann, Jens* et al. 2016
10 All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering Zürcher, Jonas et al. 2016
11 Re-building the Underfill : Performance of percolating fillers at package scale Zschenderlein, Uwe* et al. 2016
12 Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K Brunschwiler, Thomas et al. 2016
13 Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks Brunschwiler, Thomas et al. 2016
14 Advances in percolated thermal underfill (PTU) simulations for 3D-integration Kumar, Sridhar Ganesh et al. 2015
15 Embedded power insert enabling dual-side cooling of microprocessors Brunschwiler, Thomas et al. 2015
16 Mechanical characterization of sintered nanoparticles for advanced electrical and thermal joints: σ-ε-transformation in micro bending tests Zschenderlein, Uwe et al. 2015
17 Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC Vogel, Dietmar et al. 2014
18 Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC Zschenderlein, Uwe et al. 2014
19 Zerstörungsfreie Eigenspannungsbestimmung für die Zuverlässigkeitsbewertung 3D-integrierter Kontaktstrukturen in Silizium Zschenderlein, Uwe 2013
20 Monte Carlo simulation of X-ray diffraction embedded in experimental determination of residual stresses in microsystems Zschenderlein, Uwe et al. 2011
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