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Nr. Titel Autor Jahr
1 Enhancing nanostructure and energy harvesting efficiency in sustainable BCZT piezoelectric materials through calcination temperature optimization Missaoui, Sarra* et al. 2025
2 Fatigue Delamination Study of Parylene as Electronic Packaging Material Rincon, Carlos et al. 2025
3 Tailoring Nanostructure and Energy Harvesting Performance in Sustainable Bczt Piezoelectric Materials Through Calcination Temperature Control Missaoui, Sarra et al. 2025
4 Three-Omega Method for Characterization of Thermal Conductivity of Samples at Cryogenic Temperatures Rincon, Carlos et al. 2025
5 Truly integrated carbon nanotubes (CNT) in oxide ceramics for micro-strain sensing applications Rajendran, Dhivakar* et al. 2025
6 Full-Field IR-Thermography for Bond-Quality Inspection of Electroplated Aluminium Interconnects for Cryo-SiP Architectures Wunderle, Bernhard et al. 2024
7 Full-Field Through-Chip IR-Thermography-based Quality Testing & Failure Analysis on Electroplated Aluminium Interconnects for Cryogenic Applications in Ion-Trap Quantum Computers May, Daniel* et al. 2024
8 Natural fibers for performance boosting of BaTiO3-PDMS flexible piezoelectric composite generators Ayadi, Mohamed Dhia* et al. 2024
9 Physics of failure based lifetime modelling for sintered silver die attach in power electronics: Accelerated stress testing by isothermal bending and thermal shock in comparison Heilmann, Jens* et al. 2023
10 Mechanical Characterization of Compact Rolled-up Microtubes Using In Situ Scanning Electron Microscopy Nanoindentation and Finite Element Analysis Moradi, Somayeh* et al. 2021
11 Residual Stress Characterisation of Thin Sputtered Copper Films on Silicon Exploiting Membrane Resonance within a Specimen Centred Approach Wunderle, Bernhard* et al. 2020
12 Micro Bending Test on Double Cantilever Beams: A specimen-centred approach to accurate determination of the visco-plastic properties of Sintered Silver for Power Electronics applications Zschenderlein, Uwe* et al. 2019
13 Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data Wunderle, Bernhard* et al. 2018
14 Thermo-mechanical reliability of sintered all-Cu electrical fine pitch interconnects under isothermal fatigue testing benchmarked against soldered and TLP-bonded SnAg3.5 joints Kumar, Akhil et al. 2018
15 Correlation between Mechanical Material Properties and Stress in 3D-Integrated Silicon Microstructures Stiebing, Martin* et al. 2017
16 Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests Heilmann, Jens* et al. 2017
17 Advances and challenges of experimental reliability investigations for lifetime modelling of sintered silver based interconnections Heilmann, Jens* et al. 2016
18 All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering Zürcher, Jonas et al. 2016
19 Re-building the Underfill : Performance of percolating fillers at package scale Zschenderlein, Uwe* et al. 2016
20 Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K Brunschwiler, Thomas et al. 2016
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