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Nr. Titel Autor Jahr
1 FluidFM Deposition of Semicondutor Quantum Dots From Aqueous Dispersions Manoharan, Gopinath et al. 2025
2 Low-temperature ALD of metallic cobalt using the CoCOhept precursor: Simulation-assisted process development for deposition on temperature sensitive 3D-structures Franz, Mathias* et al. 2025
3 Process and equipment modeling for chemical thin film deposition Jäckel, Linda 2025
4 Fabrication of switchable biocompatible, nano-fluidic devices using a thermoresponsive polymer on nano-patterned surfaces Bickmann, Christopher* et al. 2024
5 Impact of Dielectric Types on Surface Topography for Wafer-Level Hybrid Bonding Dubey, Vikas* et al. 2024
6 Investigations on Low-Temperature Aluminium Thermocompression Bonding Using Surface Passivation Technique Diex, Kevin et al. 2024
7 Investigations on low-temperature thermocompression bonding of passivated aluminum for enhanced wafer-level packaging and heterogeneous integration Diex, Kevin* et al. 2024
8 Low Temperature LiTaO3-to-Si Wafer Bonding Richter, Dominic et al. 2024
9 Modeling the temporal evolution and stability of thin evaporating films for wafer surface processing Huber, Max* et al. 2024
10 Molecular approach to semiconductors: a shift towards ecofriendly manufacturing and neuroinspired interfaces Monakhov, Kirill Yu.* et al. 2024
11 Navigating Complex Process and Design Challenges in Hybrid Bonding for Advanced Semiconductor Integration: A Comprehensive Analysis Dubey, Vikas* et al. 2024
12 Process Development of Aluminum Electroplating from an Ionic Liquid on 150 mm Wafer Level Braun, Silvia* et al. 2024
13 Alkaline earth metal and lanthanide ethylene glycol carboxylates for metal oxide layer formation by spin coating Scharf, Sebastian et al. 2023
14 Development of a Cobalt Atomic Layer Deposition Process using Co2(CO)6HC=CC5H11 as Precursor Franz, Mathias* et al. 2023
15 Fabrication of local areas of high aspect ratio silicon structures using metal-assisted chemical etching Franz, Mathias et al. 2023
16 Fabrication of local areas of high aspect ratio silicon structures using metal-assisted chemical etching - MACE Franz, Mathias et al. 2023
17 Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding Dubey, Vikas* et al. 2023
18 Low temperature atomic layer deposition of cobalt using dicobalt hexacarbonyl-1-heptyne as precursor Franz, Mathias* et al. 2023
19 Nanolithographic Fabrication Technologies for Network-Based Biocomputation Devices Meinecke, Christoph R.* et al. 2023
20 Biocomputation Using Molecular Agents Moving in Microfluidic Channel Networks: An Alternative Platform for Information Technology Blaudeck, Thomas* et al. 2022
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Anzahl der Dokumente: 247

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