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Nr. Titel Autor Jahr
1 About the Data Analysis of Optical Emission Spectra of Reactive Ion Etching Processes—The Method of Spectral Redundancy Reduction Haase, Micha* et al. 2024
2 Combining nano-scale imprint lithography and reactive ion etching to fabricate high-quality surface relief gratings Haase, Micha et al. 2024
3 Impact of Dielectric Types on Surface Topography for Wafer-Level Hybrid Bonding Dubey, Vikas* et al. 2024
4 Navigating Complex Process and Design Challenges in Hybrid Bonding for Advanced Semiconductor Integration: A Comprehensive Analysis Dubey, Vikas* et al. 2024
5 Real-Time End Point Detection via Automated Dynamic Mode Decomposition Sayyed, Mudassir Ali* et al. 2024
6 Scalable fabrication approach and fill factor optimization for single pixel microlens arrays Bonitz, Jens* et al. 2024
7 Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding Dubey, Vikas* et al. 2023
8 Integration of (Poly-Si/Air)n Distributed Bragg Reflectors in a 150 mm Bulk Micromachined Wafer-Level MOEMS Fabrication Process Helke, Christian* et al. 2023
9 Measuring Ion Energy Distributions by Retarding Field Energy Analyzer and Using Low-Energy Ions for Si-ALE by Cl2 Dittmar, Nils et al. 2023
10 Fabrication of Nanoimprint-Lithography masters for optical nano gratings Helke, Christian et al. 2022
11 Hochauflösende Projektions-Lithografie für die Herstellung von MEMS-Strukturen mit hohem Aspekt-Verhältnis und für Nano-Imprint-Lithografie Mastern für optische Gitter Schermer, Sebastian et al. 2022
12 On the Fabrication and Characterization of Polymer-Based Waveguide Probes for Use in Future Optical Cochlear Implants Helke, Christian* et al. 2022
13 On the relationship between SiF4 plasma species and sample properties in ultra low-k etching processes Haase, Micha* et al. 2020
14 The role of plasma analytics in leading‐edge semiconductor technologies Zimmermann, Sven* et al. 2018
15 Requirements and challenges on an alternative indirect integration regime of low-k materials Haase, Micha et al. 2016
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