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Nr. Titel Autor Jahr
1 Simulations for nanoindentation on thin metal films and the potential influence of creep Johrmann, Nathanael* et al. 2021
2 Nanoindentation as part of material characterization of thin metal films Jöhrmann, Nathanael* et al. 2020
3 Residual Stress Characterisation of Thin Sputtered Copper Films on Silicon Exploiting Membrane Resonance within a Specimen Centred Approach Wunderle, Bernhard* et al. 2020
4 Spectroscopic ellipsometry and magneto-optical Kerr effect spectroscopy study of thermally treated Co60Fe20B20 thin films Hoffmann, Maria A. et al. 2020
5 Electroforming-free BiFeO3 switches for neuromorphic computing Spike-timing dependent plasticity (STDP) and cycle-number dependent plasticity (CNDP) Kiani, Mahdi et al. 2019
6 Electroforming-free Memristors for Hardware Security Primitives Du, Nan et al. 2019
7 Magneto-optical Spectroscopy and Spectroscopic Ellipsometry of Co60Fe20B20 Thin Films Sharma, Apoorva et al. 2018
8 Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data Wunderle, Bernhard* et al. 2018
9 3D Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages Hofmann, Lutz et al. 2017
10 Atomic layer deposition of ultrathin Cu2O and subsequent reduction to Cu studied by in situ x-ray photoelectron spectroscopy Dhakal, Dileep et al. 2016
11 Characterisation of the barrier formation process of self-forming barriers with CuMn, CuTi and CuZr alloys Franz, Mathias* et al. 2016
12 Requirements and challenges on an alternative indirect integration regime of low-k materials Haase, Micha et al. 2016
13 Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS Hofmann, Lutz* et al. 2016
14 3D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bonding Hofmann, Lutz et al. 2015
15 Growth Monitoring by XPS and LEIS Investigations of Ultrathin Copper Films Deposited by Atomic Layer Deposition Dhakal, Dileep et al. 2015
16 High-performance giant magnetoresistive sensorics on flexible Si membranes Pérez, Nicolás et al. 2015
17 Monolithic integration of focused 2D GMR spin valve magnetic field sensor for high-sensitivity (compass) applications Ueberschär, Olaf et al. 2015
18 Optimized Monolithic 2D Spin-Valve Sensor for High Sensitivity Compass Applications Ueberschär, Olaf et al. 2015
19 Monolithic microelectronic spin valve compass for autonomous MEMS navigation in geomagnetic field Almeida, Maria J. et al. 2014
20 Vertical Integration techniques for MEMS using HAR TSV Hofmann, Lutz et al. 2013
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