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Universitätsbibliographie

Universitätsbibliographie | Universitätsbibliothek | TU Chemnitz

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Nr.	Titel	Autor	Jahr
1	Correlation between Mechanical Material Properties and Stress in 3D-Integrated Silicon Microstructures	Stiebing, Martin* et al.	2017
2	Mechanical in-situ characterization of micro systems during encapsulation and integration processes in structural components	Rost, Florian et al.	2016
3	Stress Analysis in Semiconductor Devices by Kelvin Probe Force Microscopy	Sheremet, Evgeniya et al.	2016
4	Stress Investigations in 3D-Integrated Silicon Microstructures	Stiebing, Martin* et al.	2016
5	Challenges in the the Reliability of 3D Integration using TSVs	Stiebing, Martin et al.	2015
6	Mechanical stress induced in Si sensors during bonding and packaging processes	Rost, Florian et al.	2015
7	Thermo-mechanical Characterization of Copper Through-Silicon vias (Cu-TSVs) Using Micro-Raman Specstroscopy and Atomic Force Microscopy	Bayat, Parisa* et al.	2015
8	Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC	Vogel, Dietmar et al.	2014
9	Material parameter identification by combination of stress chipmeasurements and FE-simulation in MERGE	Rost, Florian et al.	2014
10	Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC	Zschenderlein, Uwe et al.	2014
11	Stress Analyses of High Spatial Resolution on TSV and BEoL Structures	Vogel, Dietmar* et al.	2014
12	Stress Analysis on Copper Through Silicon Vias (Cu-TSV) using Micro-Raman Spectroscopy	Bayat, Parisa et al.	2014
13	FIB/SEM Analysis for Smart Systems Integration	Waechtler, Thomas et al.	2012

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Anzahl der Dokumente:	13