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Nr. Titel Autor Jahr
1 Iron(III) β-diketonates: CVD precursors for iron oxide film formation Pousaneh, Elaheh et al. 2019
2 Synthesis of Mg and Zn diolates and their use in metal oxide deposition Frenzel, Peter et al. 2019
3 Adding CNT-based functionality to MEMS: A technology demonstration for strain and IR sensors on wafer scale Böttger, Simon et al. 2018
4 Approach to combine electron-beam lithography and two-photon polymerization for enhanced nano-channels in network-based biocomputation devices Heldt, Georg et al. 2018
5 Electrical Conductivity Modeling of Graphene-based Conductor Materials Rizzi, Leo* et al. 2018
6 Electroforming-free resistive switching in polycrystalline YMnO3 thin films Rayapati, Venkata Rao* et al. 2018
7 Fabrication and Operation of Protein-Powered Biocomputation using Nanostructured Networks Meinecke, Christoph Robert et al. 2018
8 Magnesium β-Ketoiminates as CVD Precursors for MgO Formation Lang, Heinrich* et al. 2018
9 Magnetic Tunnel Junctions: Laser Annealing Versus Oven Annealing Sharma, Apoorva et al. 2018
10 Magneto-optical Spectroscopy and Spectroscopic Ellipsometry of Co60Fe20B20 Thin Films Sharma, Apoorva et al. 2018
11 Multiscale Simulation of Metallic Copper and Copper Oxide Atomic Layer Deposition from Cu Beta-diketonates Hu, Xiao 2018
12 Performance Improvements of CNTFETs by Polymer-based Doping Control Hermann, Sascha et al. 2018
13 Polymer-based doping control for performance enhancement of wet-processed short-channel CNTFETs Hartmann, Martin* et al. 2018
14 Pulse Current Electrochemical Deposition of Copper for Through Silicon Vias in MEMS: Experiment and Simulation Hofmann, Lutz et al. 2018
15 Scaling up Integration of Carbon Nanotubes into Micro-Electro-Mechanical Systems Böttger, Simon et al. 2018
16 Spectroscopic Ellipsometry of Diffusion in Magnetic Multilayer Stacks Sharma, Apoorva et al. 2018
17 Tetranuclear yttrium and gadolinium 2-acetylcyclopentanoate clusters: Synthesis and their use as spin-coating precursors for metal oxide film formation for field-effect transistor fabrication Pousaneh, Elaheh et al. 2018
18 The role of plasma analytics in leading‐edge semiconductor technologies Zimmermann, Sven* et al. 2018
19 3D Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages Hofmann, Lutz et al. 2017
20 3D-Wafer Level Packaging approaches for MEMS by using Cu-based High Aspect Ratio Through Silicon Vias Hofmann, Lutz 2017
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Anzahl der Dokumente: 174


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