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Nr. Titel Autor Jahr
1 A Mechanical-Electrical Model to Describe the Negative Differential Resistance in Membranotronic Devices Huber, Max et al. 2024
2 About the Data Analysis of Optical Emission Spectra of Reactive Ion Etching Processes—The Method of Spectral Redundancy Reduction Haase, Micha* et al. 2024
3 Aerosol Jet Druck gradierter Nanolot-Zwischenschichten für die Montage von Komponenten elektronischer Baugruppen Seifert, Tobias et al. 2024
4 Evaluation of Thin Pd Layers for a Sensor System Monitoring Anode-Side Hydrogen Concentration in a Fuel Cell Bickmann, Christopher et al. 2024
5 Exploring Data Fusion for AI-based People Counting in a Static Public Transport Vehicle using Multiple IR-UWB Transceivers Blangiardi, Francesco et al. 2024
6 Full-Field IR-Thermography for Bond-Quality Inspection of Electroplated Aluminium Interconnects for Cryo-SiP Architectures Wunderle, Bernhard et al. 2024
7 Hot Embossing to Fabricate Parylene-Based Microstructures and Its Impact on the Material Properties Glauche, Florian et al. 2024
8 Perspective on the Development and Integration of Hydrogen Sensors for Fuel Cell Control Hauck, Michael* et al. 2024
9 Plastic Waste Recycling-A Chemical Recycling Perspective Schade, Alexander* et al. 2024
10 Additive Fertigung gradierter Nanoverbundwerkstoffe für das Fügen mikroelektronischer Komponenten Seifert, Tobias et al. 2023
11 CNT-PUFs: Highly Robust and Heat-Tolerant Carbon-Nanotube-Based Physical Unclonable Functions Frank, Florian et al. 2023
12 Efficient Quadrature Suppression for Improved Performance of a MEMS Vibratory Gyroscope Forke, Roman et al. 2023
13 Fabrication and Integration of Quantum Dot Based Emitters for Smart Mechanical Watches Langenickel, Jörn et al. 2023
14 Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging Hofmann, Christian* et al. 2023
15 Inductive heating based on VHF-ISM radio band frequencies as technology platform for efficient heating of metallic micro-scaled bonding layers in MEMS packaging Hofmann, Christian et al. 2023
16 Inductive Sintering Module for Improved Multi-Die Attach in the Field of Power Packaging Hofmann, Christian et al. 2023
17 MEMS-Based Fingerprinting Architecture for Trustworthy Electronics Meinel, Katja et al. 2023
18 Optimal design of piezoelectric MEMS for vibration monitoring system with nanoionics zero-energy memory elements Shaporin, Alexey* et al. 2023
19 Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates Selbmann, Franz* et al. 2023
20 Storing MEMS Interfaces Without Electrical Auxiliary Energy for Long-Time Monitoring Hoffmann, Martin et al. 2023
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