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Universitätsbibliographie

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Nr. Titel Autor Jahr
1 Inductive Sintering Module for Improved Multi-Die Attach in the Field of Power Packaging Hofmann, Christian et al. 2023
2 Bridging the gap: Perspectives of nanofabrication technologies for application-oriented research Baum, Mario* et al. 2021
3 Investigation of biocompatible Parylene as triboelectric layer for wearable energy harvesting Selbmann, Franz* et al. 2021
4 Silver sintering technology based on induction heating for chip level bonding Hofmann, Christian et al. 2021
5 Technologies for Power Device Packaging by Using Solid Liquid Interdiffusion Bonding - SLID Baum, Mario et al. 2021
6 Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems Selbmann, Franz et al. 2020
7 Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems Selbmann, Franz et al. 2020
8 Micro Bending Test on Double Cantilever Beams: A specimen-centred approach to accurate determination of the visco-plastic properties of Sintered Silver for Power Electronics applications Zschenderlein, Uwe* et al. 2019
9 3D-Packaging-Technologien zur Herstellung intelligenter medizinischer Implantate. Elektronische Baugruppen und Leiterplatten Wünsch, Dirk et al. 2018
10 An Improved Design for 2D Arrays of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, and Characterization Baum, Mario* et al. 2018
11 Parylene as a dielectric material for electronic applications in space Selbmann, Franz* et al. 2018
12 Thermo-mechanical reliability of sintered all-Cu electrical fine pitch interconnects under isothermal fatigue testing benchmarked against soldered and TLP-bonded SnAg3.5 joints Kumar, Akhil et al. 2018
13 3D Packaging Technologies for Smart Medical Implants Schröder, Tim et al. 2017
14 Dünnfilmverkapselungen für medizinische Anwendungen Selbmann, Franz et al. 2017
15 Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor Baum, Mario et al. 2017
16 Investigations on Parylene C for its Integrability into MEMS Selbmann, Franz et al. 2017
17 Temporary wafer bonding - key technology for MEMS devices Wünsch, Dirk* et al. 2017
18 A highly miniaturized two-axis acceleration sensor for implantable hemodynamic controlling system Wünsch, Dirk et al. 2016
19 Deposition of Parylene C and Characterization of its Hermeticity for the Encapsulation of MEMS and Medical Devices Selbmann, Franz et al. 2016
20 Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding Tanaka, Koki et al. 2016
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