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Nr.	Titel	Autor	Jahr
1	Hot Embossing to Fabricate Parylene-Based Microstructures and Its Impact on the Material Properties	Glauche, Florian et al.	2024
2	Parylene as a Novel Packaging Material for Adhesive Bonding, Flexible Electronics and Wafer Level Packaging	Selbmann, Franz et al.	2024
3	Fabrication and Integration of Quantum Dot Based Emitters for Smart Mechanical Watches	Langenickel, Jörn et al.	2023
4	Greenhouse Monitoring with Biocompatible Humidity Sensor for Smart Farming	Schlagmann, Moritz et al.	2023
5	Hollow Microneedle Fabrication and Characterization for Interstitial Fluid Extraction in Minimally Invasive Sensors	Enderlein, Tom et al.	2023
6	Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates	Selbmann, Franz* et al.	2023
7	Miniaturized and Highly Integrated Humidity Sensor with Biocompatible Sensing Material for Smart Farming	Schlagmann, Moritz et al.	2022
8	An ultra-thin and highly flexible multilayer Printed Circuit Board based on Parylene	Selbmann, Franz et al.	2021
9	Investigation of biocompatible Parylene as triboelectric layer for wearable energy harvesting	Selbmann, Franz* et al.	2021
10	Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems	Selbmann, Franz et al.	2020
11	Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems	Selbmann, Franz et al.	2020
12	Challenges in transferring quantum dot sensitized solar cells on technical textiles	Heinrich, Kathleen et al.	2018
13	Integration of quantum dot sensitized solar cells onto technical textiles	Heinrich, Kathleen et al.	2018
14	Parylene as a dielectric material for electronic applications in space	Selbmann, Franz* et al.	2018
15	Dünnfilmverkapselungen für medizinische Anwendungen	Selbmann, Franz et al.	2017
16	Investigations on Parylene C for its Integrability into MEMS	Selbmann, Franz et al.	2017
17	Deposition of Parylene C and Characterization of its Hermeticity for the Encapsulation of MEMS and Medical Devices	Selbmann, Franz et al.	2016
18	Parylene C Deposition and Characterization of its Barrier Properties for the Encapsulation of MEMS for Medical Applications	Selbmann, Franz et al.	2016
19	Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS	Hofmann, Lutz* et al.	2016

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Anzahl der Dokumente:	19