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Nr. Titel Autor Jahr
1 Fabrication and Integration of Quantum Dot Based Emitters for Smart Mechanical Watches Langenickel, Jörn et al. 2023
2 Greenhouse Monitoring with Biocompatible Humidity Sensor for Smart Farming Schlagmann, Moritz et al. 2023
3 Hollow Microneedle Fabrication and Characterization for Interstitial Fluid Extraction in Minimally Invasive Sensors Enderlein, Tom et al. 2023
4 Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates Selbmann, Franz* et al. 2023
5 Miniaturized and Highly Integrated Humidity Sensor with Biocompatible Sensing Material for Smart Farming Schlagmann, Moritz et al. 2022
6 An ultra-thin and highly flexible multilayer Printed Circuit Board based on Parylene Selbmann, Franz et al. 2021
7 Investigation of biocompatible Parylene as triboelectric layer for wearable energy harvesting Selbmann, Franz* et al. 2021
8 Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems Selbmann, Franz et al. 2020
9 Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems Selbmann, Franz et al. 2020
10 Challenges in transferring quantum dot sensitized solar cells on technical textiles Heinrich, Kathleen et al. 2018
11 Integration of quantum dot sensitized solar cells onto technical textiles Heinrich, Kathleen et al. 2018
12 Parylene as a dielectric material for electronic applications in space Selbmann, Franz* et al. 2018
13 Dünnfilmverkapselungen für medizinische Anwendungen Selbmann, Franz et al. 2017
14 Investigations on Parylene C for its Integrability into MEMS Selbmann, Franz et al. 2017
15 Deposition of Parylene C and Characterization of its Hermeticity for the Encapsulation of MEMS and Medical Devices Selbmann, Franz et al. 2016
16 Parylene C Deposition and Characterization of its Barrier Properties for the Encapsulation of MEMS for Medical Applications Selbmann, Franz et al. 2016
17 Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS Hofmann, Lutz* et al. 2016
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