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Universitätsbibliographie

Universitätsbibliographie | Universitätsbibliothek | TU Chemnitz

Ergebnis der Datenbankabfrage

Nr.	Titel	Autor	Jahr
1	Master curve synthesis by effective viscoelastic plastic material modeling	Schindler-Saefkow, Florian et al.	2016
2	Re-building the Underfill : Performance of percolating fillers at package scale	Zschenderlein, Uwe* et al.	2016
3	Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K	Brunschwiler, Thomas et al.	2016
4	Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks	Brunschwiler, Thomas et al.	2016
5	Advances in percolated thermal underfill (PTU) simulations for 3D-integration	Kumar, Sridhar Ganesh et al.	2015
6	Mechanical stress induced in Si sensors during bonding and packaging processes	Rost, Florian et al.	2015
7	Material parameter identification by combination of stress chipmeasurements and FE-simulation in MERGE	Rost, Florian et al.	2014
8	Measuring the Mechanical Relevant Shrinkage during In-Mold and Post-Mold Cure with the Stress Chip	Schindler-Saefkow, Florian et al.	2014
9	Stress impact of moisture diffusion measured with the stress chip	Schindler-Saefkow, Florian et al.	2014
10	Stress impact of moisture diffusion measured with the stress chip	Schindler-Saefkow, Florian et al.	2013
11	Stress impact of thermal-mechanical loads measured with the stress chip	Schindler-Saefkow, Florian et al.	2013
12	Stress chip measurements of the internal package stress for process characterization and health monitoring	Schindler-Saefkow, Florian et al.	2012
13	DoE Simulations with the MicroDAC-Stress-Chip for Material and Package Investigations.	Schindler-Saefkow, Florian et al.	2010

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Anzahl der Ergebnisseiten:	1
Anzahl der Dokumente:	13