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Nr. Titel Autor Jahr
1 Development of a Flexible Technique for RF Welding of Innovative Recyclable Mono-Material Packaging Films Panhale, Sushant et al. 2026
2 Direct and Indirect Electrification Concepts Based on Induction Heating for the Substitution of Gas-Intensive Production Processes Fröhlich, Alexander et al. 2026
3 Electromagnetic Heating and Intermetallic Compound Formation in Transient Inductive Chip-Level Bonding Using SnCuSn Foil for Microelectronic Applications Panhale, Sushant et al. 2026
4 Experimental Analysis of SMC-Impeders for high-frequency induction tube welding Günther, Daniel et al. 2025
5 Experimental Simulations of Longitudinal High Frequency InductionTube- and Pipe-Welding Kroll, Martin et al. 2025
6 Vorrichtung zur Fertigung von geschlossenen Profilhalbzeugen Kroll, Martin et al. 2025
7 VORRICHTUNG ZUR FERTIGUNG VON GESCHLOSSENEN PROFILHALBZEUGEN MITTELS EINES WEICHMAGNET‑POLYMER‑KOMPOSIT‑IMPEDERS Kroll, Martin et al. 2025
8 Design of an inductive sinter module for power packaging: FEM analysis and thermal management characterization based on multi-die applications Hofmann, Christian et al. 2024
9 Geometry optimization and efficiency increase of HFI welding processes while using SMC-impeders Günther, Daniel et al. 2024
10 Investigation of Wafer-Level Electromagnetic Heating of Metallic Frames at Radio Frequencies: Analysis and Characterization of Standing Waves Panhale, Sushant et al. 2024
11 Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging Hofmann, Christian* et al. 2023
12 Inductive heating based on VHF-ISM radio band frequencies as technology platform for efficient heating of metallic micro-scaled bonding layers in MEMS packaging Hofmann, Christian et al. 2023
13 Inductive Sintering Module for Improved Multi-Die Attach in the Field of Power Packaging Hofmann, Christian et al. 2023
14 Inductive Sintering of Silver Micro Particles for Bonding of Microelectronic Components Rochala, Patrick* et al. 2023
15 Induktives Solid-Liquid-Interdiffusionsbonden auf Basis miniaturisierter Induktionsspulen für die Mikrosystemtechnik Hofmann, Christian et al. 2023
16 Novel Process Approach for Additive Manufacturing Using Inductive Wire Melting by Forced Droplet Detachment Kimme, Jonas* et al. 2023
17 Verfahren zum induktiven Kontaktfügen Fröhlich, Alexander et al. 2023
18 Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils Hofmann, Christian* et al. 2022
19 Chip-level bonding for microelectronic components by induction sintering of micro structured Ag particles Rochala, Patrick et al. 2021
20 Chip-level bonding for microelectronic components by induction sintering of micro structuredAg particles Rochala, Patrick et al. 2021
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