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Nr. Titel Autor Jahr
1 Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging Hofmann, Christian* et al. 2023
2 Inductive heating based on VHF-ISM radio band frequencies as technology platform for efficient heating of metallic micro-scaled bonding layers in MEMS packaging Hofmann, Christian et al. 2023
3 Inductive Sintering Module for Improved Multi-Die Attach in the Field of Power Packaging Hofmann, Christian et al. 2023
4 Inductive Sintering of Silver Micro Particles for Bonding of Microelectronic Components Rochala, Patrick* et al. 2023
5 Induktives Solid-Liquid-Interdiffusionsbonden auf Basis miniaturisierter Induktionsspulen für die Mikrosystemtechnik Hofmann, Christian et al. 2023
6 Novel Process Approach for Additive Manufacturing Using Inductive Wire Melting by Forced Droplet Detachment Kimme, Jonas* et al. 2023
7 Verfahren zum induktiven Kontaktfügen Fröhlich, Alexander et al. 2023
8 Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils Hofmann, Christian* et al. 2022
9 Chip-level bonding for microelectronic components by induction sintering of micro structured Ag particles Rochala, Patrick et al. 2021
10 Chip-level bonding for microelectronic components by induction sintering of micro structuredAg particles Rochala, Patrick et al. 2021
11 Silver sintering technology based on induction heating for chip level bonding Hofmann, Christian et al. 2021
12 Induktives Fügen in der Mikrosystemtechnik Hofmann, Christian et al. 2020
13 Selective induction heating of metallic microstructures for wafer-level MEMS packaging Fröhlich, Alexander* et al. 2020
14 Thermal and mechanical joining of basalt fiber reinforced thermoplastic laminates Al-Obaidi, Amar* et al. 2020
15 Induktionserwärmung für das Cu-Sn SLID-Waferbonden zum Packaging in der Mikrosystemtechnik Hofmann, Christian et al. 2019
16 Manufacturing of 42SiCr-Pipes for Quenching and Partitioning by Longitudinal HFI-Welding Kroll, Martin* et al. 2019
17 Selective Induction Heating of Metallic Microstructures for Wafer-Level MEMS Packaging Fröhlich, Alexander et al. 2019
18 Verfahren zum Erwärmen einer Vielzahl von elektrisch leitfähigen Strukturen sowie Vorrichtungen zur Verwendung in dem Verfahren Fröhlich, Alexander et al. 2019
19 A highly efficient hybrid inductive joining technology for metals and composites Kräusel, Verena* et al. 2018
20 Numerische Simulation des induktiven HF-Längsnahtschweißens Ebel, Wladimir et al. 2018
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