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Nr. Titel Autor Jahr
1 Development of a Flexible Technique for RF Welding of Innovative Recyclable Mono-Material Packaging Films Panhale, Sushant et al. 2026
2 Electromagnetic Heating and Intermetallic Compound Formation in Transient Inductive Chip-Level Bonding Using SnCuSn Foil for Microelectronic Applications Panhale, Sushant et al. 2026
3 Experimental Analysis of SMC-Impeders for high-frequency induction tube welding Günther, Daniel et al. 2025
4 Experimental Simulations of Longitudinal High Frequency InductionTube- and Pipe-Welding Kroll, Martin et al. 2025
5 Vorrichtung zur Fertigung von geschlossenen Profilhalbzeugen Kroll, Martin et al. 2025
6 VORRICHTUNG ZUR FERTIGUNG VON GESCHLOSSENEN PROFILHALBZEUGEN MITTELS EINES WEICHMAGNET‑POLYMER‑KOMPOSIT‑IMPEDERS Kroll, Martin et al. 2025
7 Design of an inductive sinter module for power packaging: FEM analysis and thermal management characterization based on multi-die applications Hofmann, Christian et al. 2024
8 Geometry optimization and efficiency increase of HFI welding processes while using SMC-impeders Günther, Daniel et al. 2024
9 Investigation of Wafer-Level Electromagnetic Heating of Metallic Frames at Radio Frequencies: Analysis and Characterization of Standing Waves Panhale, Sushant et al. 2024
10 Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging Hofmann, Christian* et al. 2023
11 Inductive heating based on VHF-ISM radio band frequencies as technology platform for efficient heating of metallic micro-scaled bonding layers in MEMS packaging Hofmann, Christian et al. 2023
12 Inductive Sintering Module for Improved Multi-Die Attach in the Field of Power Packaging Hofmann, Christian et al. 2023
13 Inductive Sintering of Silver Micro Particles for Bonding of Microelectronic Components Rochala, Patrick* et al. 2023
14 Induktives Solid-Liquid-Interdiffusionsbonden auf Basis miniaturisierter Induktionsspulen für die Mikrosystemtechnik Hofmann, Christian et al. 2023
15 Novel Process Approach for Additive Manufacturing Using Inductive Wire Melting by Forced Droplet Detachment Kimme, Jonas* et al. 2023
16 Verfahren zum induktiven Kontaktfügen Fröhlich, Alexander et al. 2023
17 Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils Hofmann, Christian* et al. 2022
18 Chip-level bonding for microelectronic components by induction sintering of micro structured Ag particles Rochala, Patrick et al. 2021
19 Chip-level bonding for microelectronic components by induction sintering of micro structuredAg particles Rochala, Patrick et al. 2021
20 Silver sintering technology based on induction heating for chip level bonding Hofmann, Christian et al. 2021
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