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Nr. Titel Autor Jahr
1 Challenges of Current and Future Advanced Interconnect Systems for Integrated Circuits Schulz, Stefan E. et al. 2014
2 ALD of Transition Metals and Metal Oxides for Applications in Electronics and Sensor Devices Waechtler, Thomas et al. 2013
3 Benetzungsoptimierte Reinigungslösungen für die Entfernung von Plasmaätzresiduen für die Anwendung im Verdrahtungssystem integrierter Schaltungen Ahner, Nicole 2013
4 A Low Damage Patterning Scheme for Ultra Low-k Dielectrics Zimmermann, Sven et al. 2012
5 Optimized Wetting Behavior of Water-Based Cleaning Solutions for Plasma Etch Residue Removal by Application of Surfactants Ahner, Nicole et al. 2012
6 A less damage patterning regime for a successful integration of ultra low-k materials in modern nanoelectronic devices Zimmermann, Sven* et al. 2011
7 Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials Fischer, Tobias et al. 2011
8 Analysis of the impact of different additives during etch processes of dense and porous low-k with OES and QMS Zimmermann, Sven et al. 2010
9 Improvement of etch processes for SiCOH materials with novel in situ diagnostic and evaluation methods Zimmermann, Sven et al. 2010
10 Influence of the additives argon, O2, C4F8, H2, N2 and CO on plasma conditions and process results during the etch of SiCOH in CF4 plasma Zimmermann, Sven et al. 2010
11 Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials (Talk) Fischer, Tobias et al. 2010
12 Surface energy and wetting behaviour of plasma etched porous SiCOH surfaces and plasma etch residue cleaning solutions. Ahner, Nicole et al. 2009
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