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Nr. Titel Autor Jahr
1 Additive Fertigung gradierter Nanoverbundwerkstoffe für das Fügen mikroelektronischer Komponenten Seifert, Tobias et al. 2023
2 Fabrication and Integration of Quantum Dot Based Emitters for Smart Mechanical Watches Langenickel, Jörn et al. 2023
3 Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates Selbmann, Franz* et al. 2023
4 Nanolot - gradierte Nanoverbundwerkstoffe mit funktionsorientierten Eigenschaften zur Verarbeitung mit additiven Fertigungstechnologien Seifert, Tobias et al. 2022
5 Optimal design configuration for aluminum pillar fabrication towards fine pitch ultrasonic bonding applications Cirulis, Imants et al. 2022
6 An ultra-thin and highly flexible multilayer Printed Circuit Board based on Parylene Selbmann, Franz et al. 2021
7 Joining two worlds – hybrid integration of silicon based electronics and printed functionalities Roscher, Frank et al. 2019
8 Reactive bonding with oxide based reactive multilayers Vogel, Klaus et al. 2018
9 Investigations on Parylene C for its Integrability into MEMS Selbmann, Franz et al. 2017
10 A new approach for 3D Integration based on printed multilayers and through polymer vias Roscher, Frank* et al. 2016
11 Low Temperature Thermo Compression Bonding with Printed Intermediate Bonding Layers Wiemer, Maik et al. 2016
12 Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments Gabler, Felix* et al. 2016
13 Additive Manufacturing Technologies Compared: Morphology of Deposits of Silver Ink Using Inkjet and Aerosol Jet Printing Seifert, Tobias* et al. 2015
14 Aerosol Jet Printing of Nano Particle Based Electrical Chip Interconnects Seifert, Tobias* et al. 2015
15 Improvement of Copper Bonding by Analyzing the Mechanical Properties of the Bond Interface Vogel, Klaus et al. 2014
16 Introducing Aerosol-Jet Printing as Semiconductor and MEMS Fabrication Process Roscher, Frank et al. 2014
17 Festigkeitsanalyse an thermokompressionsgebondeten Sensorstrukturen in Abhängigkeit von der Oberflächenvorbehandlung Vogel, Klaus et al. 2012
18 Si Interposer Technologies for three dimensional AMR Sensor Systems Raukopf, S. et al. 2012
19 Aerosol Jet as a Deposition Method for Conductive Layers in Micro-System-Technology using Nanoparticle Inks Müller, Maik et al. 2011
20 Investigations of thermocompression bonding with thin metal layers Froemel, Joerg et al. 2011
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