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Nr. Titel Autor Jahr
1 Aerosol Jet Druck gradierter Nanolot-Zwischenschichten für die Montage von Komponenten elektronischer Baugruppen Seifert, Tobias et al. 2024
2 Parylene as a Novel Packaging Material for Adhesive Bonding, Flexible Electronics and Wafer Level Packaging Selbmann, Franz et al. 2024
3 Additive Fertigung gradierter Nanoverbundwerkstoffe für das Fügen mikroelektronischer Komponenten Seifert, Tobias et al. 2023
4 Fabrication and Integration of Quantum Dot Based Emitters for Smart Mechanical Watches Langenickel, Jörn et al. 2023
5 Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates Selbmann, Franz* et al. 2023
6 Nanolot - gradierte Nanoverbundwerkstoffe mit funktionsorientierten Eigenschaften zur Verarbeitung mit additiven Fertigungstechnologien Seifert, Tobias et al. 2022
7 Optimal design configuration for aluminum pillar fabrication towards fine pitch ultrasonic bonding applications Cirulis, Imants et al. 2022
8 An ultra-thin and highly flexible multilayer Printed Circuit Board based on Parylene Selbmann, Franz et al. 2021
9 Joining two worlds – hybrid integration of silicon based electronics and printed functionalities Roscher, Frank et al. 2019
10 Reactive bonding with oxide based reactive multilayers Vogel, Klaus et al. 2018
11 Investigations on Parylene C for its Integrability into MEMS Selbmann, Franz et al. 2017
12 A new approach for 3D Integration based on printed multilayers and through polymer vias Roscher, Frank* et al. 2016
13 Low Temperature Thermo Compression Bonding with Printed Intermediate Bonding Layers Wiemer, Maik et al. 2016
14 Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments Gabler, Felix* et al. 2016
15 Additive Manufacturing Technologies Compared: Morphology of Deposits of Silver Ink Using Inkjet and Aerosol Jet Printing Seifert, Tobias* et al. 2015
16 Aerosol Jet Printing of Nano Particle Based Electrical Chip Interconnects Seifert, Tobias* et al. 2015
17 Improvement of Copper Bonding by Analyzing the Mechanical Properties of the Bond Interface Vogel, Klaus et al. 2014
18 Introducing Aerosol-Jet Printing as Semiconductor and MEMS Fabrication Process Roscher, Frank et al. 2014
19 Festigkeitsanalyse an thermokompressionsgebondeten Sensorstrukturen in Abhängigkeit von der Oberflächenvorbehandlung Vogel, Klaus et al. 2012
20 Si Interposer Technologies for three dimensional AMR Sensor Systems Raukopf, S. et al. 2012
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