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Nr. Titel Autor Jahr
1 Parylene C based memristors for the realization of ultra-thin and flexible smart systems Selbmann, Franz et al. 2025
2 Advances in Parylene Adhesive Bonding for the Realization of Biocompatible Microsystems Selbmann, Franz et al. 2024
3 Aerosol Jet Druck gradierter Nanolot-Zwischenschichten für die Montage von Komponenten elektronischer Baugruppen Seifert, Tobias et al. 2024
4 Parylene as a Novel Packaging Material for Adhesive Bonding, Flexible Electronics and Wafer Level Packaging Selbmann, Franz et al. 2024
5 Additive Fertigung gradierter Nanoverbundwerkstoffe für das Fügen mikroelektronischer Komponenten Seifert, Tobias et al. 2023
6 Fabrication and Integration of Quantum Dot Based Emitters for Smart Mechanical Watches Langenickel, Jörn et al. 2023
7 Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates Selbmann, Franz* et al. 2023
8 Nanolot - gradierte Nanoverbundwerkstoffe mit funktionsorientierten Eigenschaften zur Verarbeitung mit additiven Fertigungstechnologien Seifert, Tobias et al. 2022
9 Optimal design configuration for aluminum pillar fabrication towards fine pitch ultrasonic bonding applications Cirulis, Imants et al. 2022
10 An ultra-thin and highly flexible multilayer Printed Circuit Board based on Parylene Selbmann, Franz et al. 2021
11 Joining two worlds – hybrid integration of silicon based electronics and printed functionalities Roscher, Frank et al. 2019
12 Reactive bonding with oxide based reactive multilayers Vogel, Klaus et al. 2018
13 Investigations on Parylene C for its Integrability into MEMS Selbmann, Franz et al. 2017
14 A new approach for 3D Integration based on printed multilayers and through polymer vias Roscher, Frank* et al. 2016
15 Low Temperature Thermo Compression Bonding with Printed Intermediate Bonding Layers Wiemer, Maik et al. 2016
16 Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments Gabler, Felix* et al. 2016
17 Additive Manufacturing Technologies Compared: Morphology of Deposits of Silver Ink Using Inkjet and Aerosol Jet Printing Seifert, Tobias* et al. 2015
18 Aerosol Jet Printing of Nano Particle Based Electrical Chip Interconnects Seifert, Tobias* et al. 2015
19 Improvement of Copper Bonding by Analyzing the Mechanical Properties of the Bond Interface Vogel, Klaus et al. 2014
20 Introducing Aerosol-Jet Printing as Semiconductor and MEMS Fabrication Process Roscher, Frank et al. 2014
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