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Nr. Titel Autor Jahr
1 Technologies for the integration of miniaturized silicon sensor systems Kroll, Lothar et al. 2023
2 Technologien für die Integration miniaturisierter Silizium-Sensorsysteme Arnold, Benjamin et al. 2019
3 Characterization of epoxy based highly filled die attach materials in microelectronics Maus, Ingrid et al. 2017
4 Mechanical in-situ characterization of micro systems during encapsulation and integration processes in structural components Rost, Florian et al. 2016
5 Processing-Structure-Property Correlations of Sintered Silver Abo Ras, Mohamad* et al. 2016
6 Mechanical stress induced in Si sensors during bonding and packaging processes Rost, Florian et al. 2015
7 Thermo-mechanical Characterization of Copper Through-Silicon vias (Cu-TSVs) Using Micro-Raman Specstroscopy and Atomic Force Microscopy Bayat, Parisa* et al. 2015
8 An accelerated method for characterization of bi-material interfaces in microelectronic packages under cyclic loading conditions Poshtan, Emad A. et al. 2014
9 Applications Driven by Printed Batteries Willert, Andreas et al. 2014
10 Characterization of Adhesives for Microelectronic Industry in DMA and relaxation experiments for interfacial fracture toughness characterization – difficulties and solution Maus, Ingrid et al. 2014
11 Cluster of Excellence MERGE – Integration of Micro- and Nanosystems in Hybrid Structures Kroll, Lothar et al. 2014
12 Efficiency optimization for a frictionless air flow blade fan – design study Schacht, Ralph K. B. et al. 2014
13 High Precision Vibratory MEMS Gyroscope Billep, Detlef et al. 2014
14 Material parameter identification by combination of stress chipmeasurements and FE-simulation in MERGE Rost, Florian et al. 2014
15 Measuring the Mechanical Relevant Shrinkage during In-Mold and Post-Mold Cure with the Stress Chip Schindler-Saefkow, Florian et al. 2014
16 Statistical Strength Investigation of Poly-Silicon Membranes using Microscopic Loading Tests and Numerical Simulation Brückner, John et al. 2014
17 Stress Analyses of High Spatial Resolution on TSV and BEoL Structures Vogel, Dietmar* et al. 2014
18 Stress Analysis on Copper Through Silicon Vias (Cu-TSV) using Micro-Raman Spectroscopy Bayat, Parisa et al. 2014
19 Stress impact of moisture diffusion measured with the stress chip Schindler-Saefkow, Florian et al. 2014
20 Advanced mixed-mode bending test Experimental-numerical characterization of the critical energy release rate Gc including Mixed-Mode-Angle psi in interfaces under independent external loads Schulz, Marcus et al. 2013
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