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Nr. Titel Autor Jahr
1 Development of an intra-level mix-and-match lithography process using negative-tone photoresist AR-N 4400-10 S4 to combine i-line stepper and electron beam exposure Gottwald, Markus* et al. 2025
2 Evaluation of HSQ resist Medusa 84 SiH regarding suitability for various process windows Kohlschreiber, Pia et al. 2025
3 Low-temperature ALD of metallic cobalt using the CoCOhept precursor: Simulation-assisted process development for deposition on temperature sensitive 3D-structures Franz, Mathias* et al. 2025
4 Nanolithographic waveguides, couplers and ring resonators made of Si3N4 and AlN for photonics and quantum technologies Wecker, Julia* et al. 2025
5 2.5D-patterning via i-line grayscale exposure for photonic structures and micro lens arrays Schermer, Sebastian et al. 2024
6 Aluminum-nitride-based modular photonic integrated circuit technology and characterization platform (PIC-TCP) Tank, Franz et al. 2024
7 Characterization of negative tone photoresist mr-EBL 6000.5 for i-line stepper and electron beam lithography for the Intra-Level Mix & Match Approach Schermer, Sebastian* et al. 2024
8 Characterization of Thin AlN/Ag/AlN-Reflector Stacks on Glass Substrates for MEMS Applications Behl, Christian* et al. 2024
9 Combining nano-scale imprint lithography and reactive ion etching to fabricate high-quality surface relief gratings Haase, Micha et al. 2024
10 Fabrication of switchable biocompatible, nano-fluidic devices using a thermoresponsive polymer on nano-patterned surfaces Bickmann, Christopher* et al. 2024
11 Impact of Dielectric Types on Surface Topography for Wafer-Level Hybrid Bonding Dubey, Vikas* et al. 2024
12 Navigating Complex Process and Design Challenges in Hybrid Bonding for Advanced Semiconductor Integration: A Comprehensive Analysis Dubey, Vikas* et al. 2024
13 Scalable fabrication approach and fill factor optimization for single pixel microlens arrays Bonitz, Jens* et al. 2024
14 CNT-PUFs: Highly Robust and Heat-Tolerant Carbon-Nanotube-Based Physical Unclonable Functions Frank, Florian et al. 2023
15 Development of an e-beam/i-line stepper intra-level mix and match approach with the photoresist mr-EBL 6000.5 for PIC related structures such as waveguides, ring resonators and coupling structures Reinhardt, Markus et al. 2023
16 Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding Dubey, Vikas* et al. 2023
17 Integration of (Poly-Si/Air)n Distributed Bragg Reflectors in a 150 mm Bulk Micromachined Wafer-Level MOEMS Fabrication Process Helke, Christian* et al. 2023
18 Intra-level mix and match lithography with electron beam lithography and i-line stepper combined with resolution enhancement for structures below the CD-limit Helke, Christian* et al. 2023
19 Multichannel laser diode to polymer waveguide array coupling with a double-aspheric lens Kunze, Katharina* et al. 2023
20 Tunable Fabry-Pérot interferometer integrated in a silicon waveguide of an on-chip optical platform for long infrared wavelengths Wecker, Julia et al. 2023
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Anzahl der Dokumente: 55

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