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Universitätsbibliographie

Universitätsbibliographie | Universitätsbibliothek | TU Chemnitz

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Nr.	Titel	Autor	Jahr
1	All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering	Zürcher, Jonas et al.	2016
2	Master curve synthesis by effective viscoelastic plastic material modeling	Schindler-Saefkow, Florian et al.	2016
3	Re-building the Underfill : Performance of percolating fillers at package scale	Zschenderlein, Uwe* et al.	2016
4	Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K	Brunschwiler, Thomas et al.	2016
5	Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks	Brunschwiler, Thomas et al.	2016
6	Advances in percolated thermal underfill (PTU) simulations for 3D-integration	Kumar, Sridhar Ganesh et al.	2015
7	Nanoparticle Assembly and Sintering Towards All-Copper Flip Chip Interconnects	Zuercher, Jonas et al.	2015
8	Establishing the Critical Fracture Properties of the Die Backside-to-Molding Compound Interface	Schlottig, Gerd et al.	2011
9	Fracture-Mechanical Interface Characterisation for Thermo-Mechanical Co-Design – An Efficient and Comprehensive Method for Critical Mixed-Mode Data Extraction	Wunderle, Bernhard et al.	2011
10	Delamination and Combined Compound Cracking of EMC-Copper Interfaces.	Xiao, An et al.	2010
11	Interface fracture mechanics evaluation by correlation of experiment and simulation.	Keller, Jürgen et al.	2010
12	Interfacial Fracture Parameters of Silicon-to-Molding Compound	Schlottig, Gerd et al.	2010
13	Interfacial Strength of Silicon-to-Molding Compound Changes with Thermal Residual Stress.	Schlottig, Gerd et al.	2010
14	Establishing Mixed Mode Fracture Properties of EMC-Copper (-oxide) Interfaces at Various Temperatures	Xiao, An et al.	2009
15	How to fabricate specimens for Silicon-to-Molding Compound interface adhesion measurements	Schlottig, Gerd et al.	2009
16	Induced Delamination of Silicon-Molding Compound Interfaces	Schlottig, Gerd et al.	2009

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Anzahl der Dokumente:	16