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Nr. Titel Autor Jahr
1 Physics-Based Reliability Analysis of Power Modules at Substrate and Component Level Mathew, Anu et al. 2025
2 Physics-of-Failure based Lifetime Prediction for Power Electronics under Mission Profile Load Conditions Albrecht, Jan et al. 2025
3 Digital Twin-Based Lifetime Estimation of SiC Power Modules Mathew, Anu* et al. 2024
4 Full-Field IR-Thermography for Bond-Quality Inspection of Electroplated Aluminium Interconnects for Cryo-SiP Architectures Wunderle, Bernhard et al. 2024
5 Full-Field Through-Chip IR-Thermography-based Quality Testing & Failure Analysis on Electroplated Aluminium Interconnects for Cryogenic Applications in Ion-Trap Quantum Computers May, Daniel* et al. 2024
6 Influence of Reducing the Load Level of Mission Profiles on the Remaining Useful Life of a TO220 Analyzed with a Surrogate Model Horn, Tobias Daniel et al. 2024
7 Influence of Transfer Molding on the Reliability of DCM SiC Power Modules Rudzki, Jacek* et al. 2024
8 Investigation of an approach for the determination of the current State-of-Health and improvement of service life in power modules Chacko, Jain* et al. 2024
9 Reduced-Order Model for Solder Balls – Potential of projection-based approaches for representing viscoplastic behavior Feuchter, Mike* et al. 2024
10 Study of Power Cycling Tests Superimposed with Passive Thermal Cycles on IGBT Modules Otto, Alexander et al. 2023
11 Technologies for the integration of miniaturized silicon sensor systems Kroll, Lothar et al. 2023
12 Building reliable FE simulation models for a better behavior prediction of power electronic systems Möller, Heiner et al. 2022
13 Determining adhesion of critical interfaces in microelectronics – A reverse Finite Element Modelling approach based on nanoindentation Reuther, G. M.* et al. 2022
14 Parametrically Generated FE Models for the Design for Reliability of Classical and Embedded Power Modules Kolas, Kshitij et al. 2022
15 Analysis of the stress state in QFN package during four bending experiment utilizing piezoresistive stress sensor Riegel, Daniel et al. 2021
16 Data-Driven Prediction of the Remaining useful Life of QFN Components Mounted on Printed Circuit Boards Riegel, Daniel et al. 2021
17 Data-Driven Remaining Useful Life Prediction of QFN Packages on Board Level with On-Chip Stress Sensors Riegel, Daniel et al. 2021
18 Design for Reliability of Automotive Chip Scale Packages by Calibrated Virtual Prototyping Döring, Ralf et al. 2021
19 Lifetime modelling of sintered silver interconnected power devices by FEM and experiment Mathew, Anu* et al. 2021
20 Machine learning based meta-models for sensorless thermal load prediction Riegel, Daniel et al. 2021
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Anzahl der Dokumente: 68

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