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Nr.	Titel	Autor	Jahr
1	Electromagnetic Heating and Intermetallic Compound Formation in Transient Inductive Chip-Level Bonding Using SnCuSn Foil for Microelectronic Applications	Panhale, Sushant et al.	2026
2	Design of an inductive sinter module for power packaging: FEM analysis and thermal management characterization based on multi-die applications	Hofmann, Christian et al.	2024
3	Investigation of Wafer-Level Electromagnetic Heating of Metallic Frames at Radio Frequencies: Analysis and Characterization of Standing Waves	Panhale, Sushant et al.	2024
4	Inductive Sintering Module for Improved Multi-Die Attach in the Field of Power Packaging	Hofmann, Christian et al.	2023
5	Inductive Sintering of Silver Micro Particles for Bonding of Microelectronic Components	Rochala, Patrick* et al.	2023
6	Chiplevel-Bonden durch induktives Silbersintern für die Leistungselektronik	Rochala, Patrick	2022
7	Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils	Hofmann, Christian* et al.	2022
8	Chip-level bonding for microelectronic components by induction sintering of micro structured Ag particles	Rochala, Patrick et al.	2021
9	Chip-level bonding for microelectronic components by induction sintering of micro structuredAg particles	Rochala, Patrick et al.	2021
10	Silver sintering technology based on induction heating for chip level bonding	Hofmann, Christian et al.	2021
11	Selective induction heating of metallic microstructures for wafer-level MEMS packaging	Fröhlich, Alexander* et al.	2020
12	Thermal and mechanical joining of basalt fiber reinforced thermoplastic laminates	Al-Obaidi, Amar* et al.	2020
13	Selective Induction Heating of Metallic Microstructures for Wafer-Level MEMS Packaging	Fröhlich, Alexander et al.	2019
14	A highly efficient hybrid inductive joining technology for metals and composites	Kräusel, Verena* et al.	2018

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Anzahl der Dokumente:	14