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Nr.	Titel	Autor	Jahr
1	Design of an inductive sinter module for power packaging: FEM analysis and thermal management characterization based on multi-die applications	Hofmann, Christian et al.	2024
2	Investigation of Wafer-Level Electromagnetic Heating of Metallic Frames at Radio Frequencies: Analysis and Characterization of Standing Waves	Panhale, Sushant et al.	2024
3	Inductive Sintering Module for Improved Multi-Die Attach in the Field of Power Packaging	Hofmann, Christian et al.	2023
4	Inductive Sintering of Silver Micro Particles for Bonding of Microelectronic Components	Rochala, Patrick* et al.	2023
5	Chiplevel-Bonden durch induktives Silbersintern für die Leistungselektronik	Rochala, Patrick	2022
6	Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils	Hofmann, Christian* et al.	2022
7	Chip-level bonding for microelectronic components by induction sintering of micro structured Ag particles	Rochala, Patrick et al.	2021
8	Chip-level bonding for microelectronic components by induction sintering of micro structuredAg particles	Rochala, Patrick et al.	2021
9	Silver sintering technology based on induction heating for chip level bonding	Hofmann, Christian et al.	2021
10	Selective induction heating of metallic microstructures for wafer-level MEMS packaging	Fröhlich, Alexander* et al.	2020
11	Thermal and mechanical joining of basalt fiber reinforced thermoplastic laminates	Al-Obaidi, Amar* et al.	2020
12	Selective Induction Heating of Metallic Microstructures for Wafer-Level MEMS Packaging	Fröhlich, Alexander et al.	2019
13	A highly efficient hybrid inductive joining technology for metals and composites	Kräusel, Verena* et al.	2018

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Anzahl der Dokumente:	13