Ergebnis der Datenbankabfrage
Nr. | Titel | Autor | Jahr |
---|---|---|---|
1 | Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates | Selbmann, Franz* et al. | 2023 |
2 | An ultra-thin and highly flexible multilayer Printed Circuit Board based on Parylene | Selbmann, Franz et al. | 2021 |
3 | Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems | Selbmann, Franz et al. | 2020 |
4 | Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems | Selbmann, Franz et al. | 2020 |
5 | Dünnfilmverkapselungen für medizinische Anwendungen | Selbmann, Franz et al. | 2017 |
6 | Investigations on Parylene C for its Integrability into MEMS | Selbmann, Franz et al. | 2017 |
Anzahl der Ergebnisseiten: | 1 |
Anzahl der Dokumente: | 6 |