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Nr. Titel Autor Jahr
1 Nanolithographic waveguides, couplers and ring resonators made of Si3N4 and AlN for photonics and quantum technologies Wecker, Julia* et al. 2025
2 On the Feasibility of the BDRIE-HS* Technology for a MEMS Gyroscope Forke, Roman et al. 2025
3 Advancement in the Mems Gyroscope from a Vibrating Tuning Fork to a Tuned Ring with Comb Electrodes Forke, Roman et al. 2024
4 Aerosol Jet Druck gradierter Nanolot-Zwischenschichten für die Montage von Komponenten elektronischer Baugruppen Seifert, Tobias et al. 2024
5 Aluminum-nitride-based modular photonic integrated circuit technology and characterization platform (PIC-TCP) Tank, Franz et al. 2024
6 Characterization of Thin AlN/Ag/AlN-Reflector Stacks on Glass Substrates for MEMS Applications Behl, Christian* et al. 2024
7 High precision electrostatic MEMS actuators for in-plane Fabry-Pérot gas sensors Shaporin, Alexey* et al. 2024
8 High Sensitivity Mode-Localized Ring Resonator With Tunable Sensitivity Tsukamoto, Takashiro et al. 2024
9 Mode Localization and Frequency Modulation Sensing Using Superposed in-Phase and Anti-Phase Oscillations Tsukamoto, Takashiro et al. 2024
10 Reliability Assessment and Defect Characterization of Piezoelectric Thin Films Ho, Kuan-Ting 2024
11 Additive Fertigung gradierter Nanoverbundwerkstoffe für das Fügen mikroelektronischer Komponenten Seifert, Tobias et al. 2023
12 Efficient Quadrature Suppression for Improved Performance of a MEMS Vibratory Gyroscope Forke, Roman et al. 2023
13 Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging Hofmann, Christian* et al. 2023
14 Inductive heating based on VHF-ISM radio band frequencies as technology platform for efficient heating of metallic micro-scaled bonding layers in MEMS packaging Hofmann, Christian et al. 2023
15 Inductive Sintering of Silver Micro Particles for Bonding of Microelectronic Components Rochala, Patrick* et al. 2023
16 Induktives Solid-Liquid-Interdiffusionsbonden auf Basis miniaturisierter Induktionsspulen für die Mikrosystemtechnik Hofmann, Christian et al. 2023
17 Integration of (Poly-Si/Air)n Distributed Bragg Reflectors in a 150 mm Bulk Micromachined Wafer-Level MOEMS Fabrication Process Helke, Christian* et al. 2023
18 MEMS-Based Fingerprinting Architecture for Trustworthy Electronics Meinel, Katja et al. 2023
19 Tunable Fabry-Pérot interferometer integrated in a silicon waveguide of an on-chip optical platform for long infrared wavelengths Wecker, Julia et al. 2023
20 High-G Acceleration Sensors for the Automotive Industry Pregl, Sebastian et al. 2022
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Anzahl der Dokumente: 172

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