Ergebnis der Datenbankabfrage
Nr. | Titel | Autor | Jahr |
---|---|---|---|
1 | Reaktives Bonden | Vogel, Klaus et al. | 2021 |
2 | Evaluation of sputtered Pd76Cu6Si18 metallic glass for MEMS application | Vogel, Klaus et al. | 2015 |
3 | Fabrication of nanoporous gold and the application for substrate bonding at low temperature | Wang, Wei-Shan et al. | 2015 |
4 | Metallic glass as a mechanical material for micro scanners | Lin, Yu-Ching* et al. | 2015 |
5 | On-Chip Micro-Pseudocapacitors for Ultrahigh Energy and Power Delivery | Han, Jiuhui et al. | 2015 |
6 | Metal interlayer based semiconductor wafer bonding | Frömel, Jörg et al. | 2013 |
7 | Solid Liquid Interdiffusion Bonding for Micro Devices near Room Temperature | Frömel, Jörg et al. | 2013 |
8 | A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface | Haubold, Marco et al. | 2012 |
Anzahl der Ergebnisseiten: | 1 |
Anzahl der Dokumente: | 8 |