Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Impact of Dielectric Types on Surface Topography for Wafer-Level Hybrid Bonding | Dubey, Vikas* et al. | 2024 |
| 2 | Investigations on Low-Temperature Aluminium Thermocompression Bonding Using Surface Passivation Technique | Diex, Kevin et al. | 2024 |
| 3 | Low Temperature LiTaO3-to-Si Wafer Bonding | Richter, Dominic et al. | 2024 |
| 4 | Navigating Complex Process and Design Challenges in Hybrid Bonding for Advanced Semiconductor Integration: A Comprehensive Analysis | Dubey, Vikas* et al. | 2024 |
| 5 | Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding | Dubey, Vikas* et al. | 2023 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 5 |
