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Universitätsbibliographie

Universitätsbibliographie | Universitätsbibliothek | TU Chemnitz

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Nr.	Titel	Autor	Jahr
1	Thermo-mechanical reliability of sintered all-Cu electrical fine pitch interconnects under isothermal fatigue testing benchmarked against soldered and TLP-bonded SnAg3.5 joints	Kumar, Akhil et al.	2018
2	All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering	Zürcher, Jonas et al.	2016
3	Master curve synthesis by effective viscoelastic plastic material modeling	Schindler-Saefkow, Florian et al.	2016
4	Re-building the Underfill : Performance of percolating fillers at package scale	Zschenderlein, Uwe* et al.	2016
5	Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K	Brunschwiler, Thomas et al.	2016
6	Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks	Brunschwiler, Thomas et al.	2016
7	Stress Investigations in 3D-Integrated Silicon Microstructures	Stiebing, Martin* et al.	2016
8	Advances in percolated thermal underfill (PTU) simulations for 3D-integration	Kumar, Sridhar Ganesh et al.	2015
9	Embedded power insert enabling dual-side cooling of microprocessors	Brunschwiler, Thomas et al.	2015
10	Nanoparticle Assembly and Sintering Towards All-Copper Flip Chip Interconnects	Zuercher, Jonas et al.	2015
11	Self-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects	Hofmann, Christian et al.	2015
12	Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks	Brunschwiler, Thomas et al.	2012
13	Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks	Brunschwiler, Thomas et al.	2011

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