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Eintrag in der Universitätsbibliographie der TU Chemnitz

Liu, Xing ; Basler, Thomas ; Bäumler, Christian ; Fürgut, Edward ; Scholz, Wolfgang ; Schmoelzer, Bernd

Semiconductor Package or a Printed Circuit Board, Both Modified to One or More of Reduce, Inverse or Utilize Magnetic Coupling Caused by the Load Current of a Semiconductor Transistor

Kurzfassung in englisch

A semiconductor package comprises a semiconductor transistor circuit comprising a semiconductor transistor die comprising die terminals, including a collector/drain, a source/emitter, a sense source/sense emitter, a gate, and a load path, a driver line connected with the gate, and a gate control loop in which the a sense source/sense emitter is connected with the driver line, a plurality of external contacts comprising at least one first external contact connected with the drain/collector, at least one second external contact connected with the source/emitter, a third external contact connected with the a sense source/sense emitter, and a fourth external contact connected with the gate, wherein the plurality of external contacts are arranged or configured to reduce or utilize the magnetic coupling induced by a load current flowing through the load path.

Universität: Technische Universität Chemnitz
Institut: Professur Leistungselektronik
Dokumentart: Patent (Offenlegungsschrift, Patentschrift, Gebrauchsmusterschrift)
Veröffentlichungsnummer: US020240014104A1
Veröffentlichungsdatum 11.01.2024
Internationale Patentklassifikation H01L 23/495 (20060101); H01L 23/00 (20060101); H05K 1/02 (20060101)


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