Eintrag in der Universitätsbibliographie der TU Chemnitz
Hofmann, Christian* ; Froehlich, Alexander ; Kimme, Jonas ; Wiemer, Maik ; Otto, Thomas
A Novel Method for MEMS Wafer-Level Packaging: Selective and Rapid Induction Heating for Copper-Tin SLID Bonding
| Universität: | Technische Universität Chemnitz | |
| Institut 1: | Zentrum für Mikrotechnologien (ZfM) | |
| Institut 2: | Professur Umformtechnik | |
| Institut 3: | Professur Smart Systems Integration | |
| Dokumentart: | Konferenzbeitrag, referiert | |
| ISBN/ISSN: | 978-1-5386-8105-3 ; 978-1-5386-8104-6 ; 2167-0013 ; 2167-0021 | |
| DOI: | doi:10.1109/TRANSDUCERS.2019.8808256 | |
| URL/URN: | https://ieeexplore.ieee.org/document/8808256/authors#authors | |
| Quelle: | 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), 2019 June 23-27, Berlin (Germany). - IEEE, p 277 - 280 | |
| Freie Schlagwörter (Englisch): | Wafer bonding , Cu-Sn SLID , inductor , selective induction heating , high-frequency electromagnetic field , Inductors , Bonding , Induction heating , Temperature , Electromagnetic heating , Electromagnetic fields | |
Bemerkung: |
_MA!N_ |
