Ergebnis der Datenbankabfrage
Nr. | Titel | Autor | Jahr |
---|---|---|---|
1 | Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data | Wunderle, Bernhard* et al. | 2018 |
2 | Correlation between Mechanical Material Properties and Stress in 3D-Integrated Silicon Microstructures | Stiebing, Martin* et al. | 2017 |
3 | Stress Investigations in 3D-Integrated Silicon Microstructures | Stiebing, Martin* et al. | 2016 |
4 | Challenges in the the Reliability of 3D Integration using TSVs | Stiebing, Martin et al. | 2015 |
5 | Accelerated reliability testing and modeling of Cu-plated through encapsulant vias (TEVs) for 3D-integration | Wunderle, Bernhard et al. | 2013 |
6 | Reliability of Cu-plated through encapsulant vias (TEV) for 3D-integration | Heilmann, Jens et al. | 2013 |
Anzahl der Ergebnisseiten: | 1 |
Anzahl der Dokumente: | 6 |