Ergebnis der Datenbankabfrage

Nr.	Titel	Autor	Jahr
1	2.5D-patterning via i-line grayscale exposure for photonic structures and micro lens arrays	Schermer, Sebastian et al.	2024
2	Aluminum-nitride-based modular photonic integrated circuit technology and characterization platform (PIC-TCP)	Tank, Franz et al.	2024
3	Characterization of negative tone photoresist mr-EBL 6000.5 for i-line stepper and electron beam lithography for the Intra-Level Mix & Match Approach	Schermer, Sebastian* et al.	2024
4	Scalable fabrication approach and fill factor optimization for single pixel microlens arrays	Bonitz, Jens* et al.	2024
5	Development of an e-beam/i-line stepper intra-level mix and match approach with the photoresist mr-EBL 6000.5 for PIC related structures such as waveguides, ring resonators and coupling structures	Reinhardt, Markus et al.	2023
6	Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding	Dubey, Vikas* et al.	2023
7	Intra-level mix and match lithography with electron beam lithography and i-line stepper combined with resolution enhancement for structures below the CD-limit	Helke, Christian* et al.	2023
8	High-resolution projection lithography for MEMS-applications using thick photoresist AZ 10XT	Schermer, Sebastian et al.	2022
9	Hochauflösende Projektions-Lithografie für die Herstellung von MEMS-Strukturen mit hohem Aspekt-Verhältnis und für Nano-Imprint-Lithografie Mastern für optische Gitter	Schermer, Sebastian et al.	2022