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Nr. Titel Autor Jahr
1 Technologies for the integration of miniaturized silicon sensor systems Kroll, Lothar et al. 2023
2 Technologien für die Integration miniaturisierter Silizium-Sensorsysteme Arnold, Benjamin et al. 2019
3 Technologies for the integration of miniaturised silicon sensor systems in fibre-reinforced composites Arnold, Benjamin et al. 2018
4 Development of sensor integration concept for mass production processes Rost, Florian et al. 2017
5 Prozess- und Zustandsüberwachung von Leichtbaustrukturen durch Sensorintegration Rost, Florian et al. 2017
6 Technologies for the integration of miniaturized silicon sensor systems in fiber reinforced composites Arnold, Benjamin et al. 2017
7 Mechanical in-situ characterization of micro systems during encapsulation and integration processes in structural components Rost, Florian et al. 2016
8 Mechanical stress induced in Si sensors during bonding and packaging processes Rost, Florian et al. 2015
9 Preliminary Investigations of Processing Impact on Microelectronic Devices by Injection Moulding Technology Nossol, Patryk et al. 2015
10 Material parameter identification by combination of stress chipmeasurements and FE-simulation in MERGE Rost, Florian et al. 2014
11 Measuring the Mechanical Relevant Shrinkage during In-Mold and Post-Mold Cure with the Stress Chip Schindler-Saefkow, Florian et al. 2014
12 Stress impact of moisture diffusion measured with the stress chip Schindler-Saefkow, Florian et al. 2014
13 Stress impact of moisture diffusion measured with the stress chip Schindler-Saefkow, Florian et al. 2013
14 Stress impact of thermal-mechanical loads measured with the stress chip Schindler-Saefkow, Florian et al. 2013
15 Stress chip measurements of the internal package stress for process characterization and health monitoring Schindler-Saefkow, Florian et al. 2012
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