Ergebnis der Datenbankabfrage
Nr. | Titel | Autor | Jahr |
---|---|---|---|
1 | ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems. | Waechtler, Thomas et al. | 2011 |
2 | Copper films grown via copper oxide ALD integrated with different liner materials for interconnect applications | Waechtler, Thomas et al. | 2011 |
3 | The Inhibition of Enhanced Cu Oxidation on Ruthenium/Diffusion Barrier Layers for Cu Interconnects by Carbon Alloying into Ru | Ding, Shao-Feng et al. | 2011 |
4 | Thermal ALD of Cu via reduction of CuxO films for the advanced metallization in spintronic and ULSI interconnect systems | Mueller, Steve et al. | 2011 |
Anzahl der Ergebnisseiten: | 1 |
Anzahl der Dokumente: | 4 |