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Nr.	Titel	Autor	Jahr
1	Development of a Flexible Technique for RF Welding of Innovative Recyclable Mono-Material Packaging Films	Panhale, Sushant et al.	2026
2	Electromagnetic Heating and Intermetallic Compound Formation in Transient Inductive Chip-Level Bonding Using SnCuSn Foil for Microelectronic Applications	Panhale, Sushant et al.	2026
3	Design of an inductive sinter module for power packaging: FEM analysis and thermal management characterization based on multi-die applications	Hofmann, Christian et al.	2024
4	Investigation of Wafer-Level Electromagnetic Heating of Metallic Frames at Radio Frequencies: Analysis and Characterization of Standing Waves	Panhale, Sushant et al.	2024
5	Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging	Hofmann, Christian* et al.	2023
6	Inductive heating based on VHF-ISM radio band frequencies as technology platform for efficient heating of metallic micro-scaled bonding layers in MEMS packaging	Hofmann, Christian et al.	2023
7	Inductive Sintering Module for Improved Multi-Die Attach in the Field of Power Packaging	Hofmann, Christian et al.	2023
8	Inductive Sintering of Silver Micro Particles for Bonding of Microelectronic Components	Rochala, Patrick* et al.	2023
9	Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils	Hofmann, Christian* et al.	2022
10	Silver sintering technology based on induction heating for chip level bonding	Hofmann, Christian et al.	2021

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Anzahl der Ergebnisseiten:	1
Anzahl der Dokumente:	10