Ergebnis der Datenbankabfrage
Nr. | Titel | Autor | Jahr |
---|---|---|---|
1 | The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods | Gadhiya, Ghanshyam et al. | 2020 |
2 | Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line | Gadhiya, Ghanshyam* et al. | 2020 |
3 | Assessment of FOWLP process dependent wafer warpage using parametric FE study | Gadhiya, Ghanshyam et al. | 2019 |
4 | Reliability of IoT Sensor Systems: New Methods for the Efficient and Comprehensive Reliability Assessment | Albrecht, Jan* et al. | 2019 |
5 | The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs | Gadhiya, Ghanshyam et al. | 2019 |
6 | Automated Virtual Prototyping for Fastest Time-to-Market of New System in Package Solutions | Gadhiya, Ghanshyam* et al. | 2018 |
Anzahl der Ergebnisseiten: | 1 |
Anzahl der Dokumente: | 6 |