Eintrag in der Universitätsbibliographie der TU Chemnitz
Gadhiya, Ghanshyam* ; Kuisma, Heikki ; Cardoso, André ; Brämer, Birgit ; Rzepka, Sven ; Otto, Thomas
Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line
Universität: | Technische Universität Chemnitz | |
Institut: | Professur Smart Systems Integration | |
Dokumentart: | Konferenzbeitrag, referiert | |
ISBN/ISSN: | 978-1-7281-6049-8 ; 978-1-7281-6050-4 | |
DOI: | doi:10.1109/EuroSimE48426.2020.9152629 | |
URL/URN: | https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9152629 | |
Quelle: | 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020 Jul 5-8, Cracow (Poland). - IEEE Xplore, 2020 | |
Freie Schlagwörter (Englisch): | Strain , Finite element analysis , Reliability engineering , Creep , Automotive engineering , Load modeling |