Ergebnis der Datenbankabfrage

Nr.	Titel	Autor	Jahr
1	Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding	Dubey, Vikas* et al.	2023
2	Visual Place Recognition: A Tutorial	Schubert, Stefan et al.	2023
3	A plasma assisted in situ restoration process for sidewall damaged ULK dielectrics	Koehler, Nicole* et al.	2016
4	Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS	Hofmann, Lutz* et al.	2016
5	Experimental and Theoretical Investigations on an in situ k-restore Process with Plasma Enhanced Fragmentation for Damaged ULK Materials	Förster, Anja et al.	2015
6	Challenges of Current and Future Advanced Interconnect Systems for Integrated Circuits	Schulz, Stefan E. et al.	2014
7	A Low Damage Patterning Scheme for Ultra Low-k Dielectrics	Zimmermann, Sven et al.	2012
8	A two-step UV curing process for producing high tensile stressed silicon nitride layers	Fischer, Tobias et al.	2012
9	A less damage patterning regime for a successful integration of ultra low-k materials in modern nanoelectronic devices	Zimmermann, Sven* et al.	2011
10	Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials	Fischer, Tobias et al.	2011
11	Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials (Talk)	Fischer, Tobias et al.	2010