Ergebnis der Datenbankabfrage
Nr. | Titel | Autor | Jahr |
---|---|---|---|
1 | Variable-shaped e-beam lithography enabling process development for future copper damascene technology | Jaschinsky, Philipp et al. | 2011 |
2 | Analysis of the impact of different additives during etch processes of dense and porous low-k with OES and QMS | Zimmermann, Sven et al. | 2010 |
3 | Improvement of etch processes for SiCOH materials with novel in situ diagnostic and evaluation methods | Zimmermann, Sven et al. | 2010 |
4 | Influence of the additives argon, O2, C4F8, H2, N2 and CO on plasma conditions and process results during the etch of SiCOH in CF4 plasma | Zimmermann, Sven et al. | 2010 |
Anzahl der Ergebnisseiten: | 1 |
Anzahl der Dokumente: | 4 |