Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Multiscale residual stress analysis in thin film layers | Weißbach, Marie et al. | 2018 |
| 2 | Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC | Vogel, Dietmar et al. | 2014 |
| 3 | Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC | Zschenderlein, Uwe et al. | 2014 |
| 4 | Statistical Strength Investigation of Poly-Silicon Membranes using Microscopic Loading Tests and Numerical Simulation | Brückner, John et al. | 2014 |
| 5 | Stress Analyses of High Spatial Resolution on TSV and BEoL Structures | Vogel, Dietmar* et al. | 2014 |
| 6 | FIB/SEM Analysis for Smart Systems Integration | Waechtler, Thomas et al. | 2012 |
| 7 | REM/FIB-Analytik für die Smart Systems Integration | Waechtler, Thomas et al. | 2011 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 7 |
