Eintrag in der Universitätsbibliographie der TU Chemnitz
Mathew, Anu* ; Dudek, Rainer ; Otto, Alexander ; Scherf, Christina ; Rzepka, Sven ; Subbiah, Nilavzhagan ; Rane, Kashmira Arvind ; Wilde, Jürgen
Lifetime modelling of sintered silver interconnected power devices by FEM and experiment
| Universität: | Technische Universität Chemnitz | |
| Institut: | Zentrum für Mikrotechnologien (ZfM) | |
| Dokumentart: | Konferenzbeitrag, referiert | |
| ISBN/ISSN: | 978-1-6654-1373-2 ; 978-1-6654-1374-9 | |
| DOI: | doi:10.1109/EuroSimE52062.2021.9410877 | |
| URL/URN: | https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9410877 | |
| Quelle: | 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021 April 19-21, St. Julian (Malta). - IEEE Xplore, 2021 | |
| Freie Schlagwörter (Englisch): | claddings , failure analysis , finite element analysis , insulated gate bipolar transistors , microassembling , plastics , printed circuits , silver , sintering , solders , Insulated gate bipolar transistors , Silver , Wires , Integrated circuit interconnections , Lead , Finite element analysis , Plastics |
