Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Physics-Based Reliability Analysis of Power Modules at Substrate and Component Level | Mathew, Anu et al. | 2025 |
| 2 | Digital Twin-Based Lifetime Estimation of SiC Power Modules | Mathew, Anu* et al. | 2024 |
| 3 | Influence of Transfer Molding on the Reliability of DCM SiC Power Modules | Rudzki, Jacek* et al. | 2024 |
| 4 | Lifetime modelling of sintered silver interconnected power devices by FEM and experiment | Mathew, Anu* et al. | 2021 |
| 5 | Modelling the Lifetime of Heavy Wire-bonds in Power Devices - Concepts, Limitations and Challenges | Otto, Alexander* et al. | 2021 |
| 6 | Reliability Modelling for Different Wire Bonding Technologies based on FEA and Nano-Indentation | Dudek, Rainer* et al. | 2020 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 6 |
