Ergebnis der Datenbankabfrage

Nr.	Titel	Autor	Jahr
1	Building reliable FE simulation models for a better behavior prediction of power electronic systems	Möller, Heiner et al.	2022
2	Determining adhesion of critical interfaces in microelectronics – A reverse Finite Element Modelling approach based on nanoindentation	Reuther, G. M.* et al.	2022
3	Design for Reliability of Automotive Chip Scale Packages by Calibrated Virtual Prototyping	Döring, Ralf et al.	2021
4	Lifetime modelling of sintered silver interconnected power devices by FEM and experiment	Mathew, Anu* et al.	2021
5	Modelling the Lifetime of Heavy Wire-bonds in Power Devices - Concepts, Limitations and Challenges	Otto, Alexander* et al.	2021
6	Studies on Thermo-Mechanical Reliability of High Performance Vehicle Computers Based on a Mock-up System	Dudek, Rainer et al.	2021
7	Reliability Modelling for Different Wire Bonding Technologies based on FEA and Nano-Indentation	Dudek, Rainer* et al.	2020
8	Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data	Wunderle, Bernhard* et al.	2018
9	Statistical Strength Investigation of Poly-Silicon Membranes using Microscopic Loading Tests and Numerical Simulation	Brückner, John et al.	2014
10	Determination of interface fracture parameters by shear testing using different theoretical approaches	Dudek, Rainer et al.	2012