Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Correlation between Mechanical Material Properties and Stress in 3D-Integrated Silicon Microstructures | Stiebing, Martin* et al. | 2017 |
| 2 | Stress Investigations in 3D-Integrated Silicon Microstructures | Stiebing, Martin* et al. | 2016 |
| 3 | Challenges in the the Reliability of 3D Integration using TSVs | Stiebing, Martin et al. | 2015 |
| 4 | SIMEIT-Project: High Precision Inertial Sensor Integration on a Modular 3D-Interposer Platform | Steller, Wolfram et al. | 2014 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 4 |
