Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates | Selbmann, Franz* et al. | 2023 |
| 2 | Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils | Hofmann, Christian* et al. | 2022 |
| 3 | Characterization of Capacitive Micromachined Ultrasound Transducer (Cmut) for Targeted Applications in Harsh Environments | Saeidi, Nooshin* et al. | 2021 |
| 4 | Silver sintering technology based on induction heating for chip level bonding | Hofmann, Christian et al. | 2021 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 4 |
