Ergebnis der Datenbankabfrage
Nr. | Titel | Autor | Jahr |
---|---|---|---|
1 | Thermal Test Vehicle for HPC - System Level Approach for Investigation of the Thermal Heat Path Signature with the Property of Spatial Resolution | Sternberg, Maik* et al. | 2023 |
2 | Finite Element Supported Data Augmentation for a Deep Learning Driven Intelligent Failure Analysis System Based on Infrared Thermography | Pareek, Kaushal Arun* et al. | 2022 |
3 | Thermal Heat Path Signature of a Standard D2PAK Power Package by Transient Thermal Characterization and Modelling | Sternberg, Maik* et al. | 2022 |
4 | Towards development of an intelligent failure analysis system based on infrared thermography | Pareek, Kaushal Arun* et al. | 2022 |
5 | Effect of Different Deconvolution Methods on Structure Function Calculation | Pareek, Kaushal Arun* et al. | 2020 |
6 | Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data | Wunderle, Bernhard* et al. | 2018 |
Anzahl der Ergebnisseiten: | 1 |
Anzahl der Dokumente: | 6 |