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Nr.	Titel	Autor	Jahr
1	Failure Analysis for Electronic Packaging Materials: A Comparative Study of Pulsed Thermography and Lock-in Thermography	Wu, Yanan* et al.	2025
2	Physics-Informed Synthetic Data Generation for Deep Learning-Based Defect Detection in Infrared Thermography	Pareek, Kaushal Arun	2025
3	Thermal-Resistance-Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load-Cycling	Sternberg, Maik et al.	2025
4	Enhancing Defect Detection Using Lock In Thermography	Mohamed, Doaa* et al.	2024
5	Synthetic data generation using finite element method to pre-train an image segmentation model for defect detection using infrared thermography	Pareek, Kaushal Arun* et al.	2024
6	Thermal Test Vehicle for HPC - System Level Approach for Investigation of the Thermal Heat Path Signature with the Property of Spatial Resolution	Sternberg, Maik* et al.	2023
7	Finite Element Supported Data Augmentation for a Deep Learning Driven Intelligent Failure Analysis System Based on Infrared Thermography	Pareek, Kaushal Arun* et al.	2022
8	Thermal Heat Path Signature of a Standard D2PAK Power Package by Transient Thermal Characterization and Modelling	Sternberg, Maik* et al.	2022
9	Towards development of an intelligent failure analysis system based on infrared thermography	Pareek, Kaushal Arun* et al.	2022
10	Effect of Different Deconvolution Methods on Structure Function Calculation	Pareek, Kaushal Arun* et al.	2020
11	Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data	Wunderle, Bernhard* et al.	2018

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Anzahl der Dokumente:	11