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Nr. Titel Autor Jahr
1 Reliability of Wide Bandgap Semiconductors for Automotive Applications Kaminski, Nando* et al. 2026
2 Influence of Switching Loss Magnitude on Lifetime During a Switch-Mode Power Cycling Test of SiC MOSFETs Abuogo, James* et al. 2025
3 Influencing Parameters on the Dynamic On-State Resistance RDS,on in GaN HEMTs and its Recovery Behavior Goller, Maximilian* et al. 2025
4 Thermal Characterization of Electrically Conductive Adhesives and Pressureless Sinter Pastes Comparison of Data Sheet and Real Application Steller, Antje et al. 2025
5 Utilization of the IGBT On-Chip Temperature Sensor for Online Temperature Monitoring Considering Continuous Switching Operation Lakshmanan, Narender et al. 2025
6 An Improved Approach for an Intermediate Measurement Routine of Dynamic On-State Resistance for GaN Power Devices Goller, Maximilian et al. 2024
7 Determination of the Junction Temperature Under Load Current in GaN Power Devices with Schottky Gate Leakage Current as TSEP Goller, Maximilian et al. 2024
8 Investigation of the Trapping and Detrapping Behavior by the On-State Resistance at Low Off-State Drain Bias in Schottky p-GaN Gate HEMTs Goller, Maximilian* et al. 2024
9 Adapted Temperature Calibration for Schottky p-GaN Power HEMTs Goller, Maximilian et al. 2023
10 Comparison of IGBT Junction Temperature Determination using an On-Chip Sensor and the VCE(T) Method Lakshmanan, Narender* et al. 2023
11 Reliability Investigations on 650 V Schottky p-GaN Power Gallium Nitride HEMTs Goller, Maximilian et al. 2023
12 Zuverlässigkeit von AlGaN/GaN-Leistungsbauelementen Franke, Jörg 2022
13 Power Cycling Results of Discrete Gallium Nitride Gate Injection Transistors Goller, Maximilian* et al. 2021
14 Reliability aspects of 3D integrated power devices Bäumler, Christian* et al. 2021
15 Investigation of the current collapse behaviour in GaN power HEMTs with highly adjustable pulse and measurement concept Goller, Maximilian* et al. 2020
16 Advanced Temperature Estimation in Low Rds,on p-GaN HEMT Devices for Performing Power Cycling Tests Franke, Jörg* et al. 2019
17 Reliability test results of PCB soldered GaN GIT devices Boldyrjew-Mast, Roman* et al. 2019
18 Investigation of thermal conditions in power modules for traction application depending on the delamination of the system solder Schwabe, Christian et al. 2018
19 Power cycling reliability results of GaN HEMT devices Franke, Jörg* et al. 2018
20 Reliability and reliability investigation of wide-bandgap power devices Lutz, Josef* et al. 2018
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