Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Thermo-mechanical Characterization of Copper Through-Silicon vias (Cu-TSVs) Using Micro-Raman Specstroscopy and Atomic Force Microscopy | Bayat, Parisa* et al. | 2015 |
| 2 | Interaction of gold nanoparticles with wafer-level integrated carbon nanotubes probed by Raman spectroscopy | Rodriguez, Raul D. et al. | 2014 |
| 3 | Nanometallization of Arrays of Carbon Nanotube Field-Effect Transistors Using a Wafer-Level Stop-and-Go Microfluidic Approach | Blaudeck, Thomas et al. | 2014 |
| 4 | Stress Analyses of High Spatial Resolution on TSV and BEoL Structures | Vogel, Dietmar* et al. | 2014 |
| 5 | Stress Analysis on Copper Through Silicon Vias (Cu-TSV) using Micro-Raman Spectroscopy | Bayat, Parisa et al. | 2014 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 5 |
