Eintrag in der Universitätsbibliographie der TU Chemnitz
May, Daniel* ; Heilmann, J. ; Boschman, E. ; Abo Ras, M. ; Wunderle, B.
Tilt- and warpage measurement of bonded dies as an inline quality assessment tool
| Universität: | Technische Universität Chemnitz | |
| Institut: | Professur Werkstoffe und Zuverlässigkeit mikrotechnischer Systeme | |
| Dokumentart: | Konferenzbeitrag, referiert | |
| ISBN/ISSN: | Electronic ISBN:978-1-6654-1373-2 ; Print on Demand(PoD) ISBN:978-1-6654-1374-9 | |
| DOI: | doi:10.1109/eurosime52062.2021.9410832 | |
| Quelle: | 22st EuroSimE Confernce, virtual event, April 19-22, 2021. - IEEE | |
| Freie Schlagwörter (Englisch): | Vibrations , Insulated gate bipolar transistors , Semiconductor device measurement , Production , Thermal sensors , Vibration measurement , Tools, acoustic microscopy , delamination , failure analysis , porosity , power electronics , silver , sintering , thermal conductivity , thermal management (packaging), warpage measurement , inline quality assessment tool , semiconductor dies , power electronics , silver sintering , reliability problems , thermal conductivity , scanning acoustic microscopy , pulsed infrared thermography , SoA failure analytical technique , industrial production condition , mechanical vibrations | |
Bemerkung: |
_MA!N_ |
