Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Full-Field Through-Chip IR-Thermography-based Quality Testing & Failure Analysis on Electroplated Aluminium Interconnects for Cryogenic Applications in Ion-Trap Quantum Computers | May, Daniel* et al. | 2024 |
| 2 | Inline Failure Analysis of Sintered Layers in Power Modules using Infrared Thermography | Panahandeh, S.* et al. | 2022 |
| 3 | Tilt- and warpage measurement as inline quality assessment tool | May, D.* et al. | 2022 |
| 4 | Tilt- and warpage measurement of bonded dies as an inline quality assessment tool | May, Daniel* et al. | 2021 |
| 5 | Inspection of silver-sinter die attaches by pulsed and lock-in infrared thermography with flash lamp and laser excitation | Wargulski, D. R. et al. | 2020 |
| 6 | Pulsed Infrared Thermography Failure Analysis of Low-emissivity Specimens Without Contaminations Caused by High-emissivity Coatings | Wargulski, D. R.* et al. | 2020 |
| 7 | Thermal Characterisation and Failure Analysis of MMIC Components by Thermo-Reflectance Imaging | May, Daniel* et al. | 2020 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 7 |
